Package Intersil W8x12.96

ManufacturerIntersil
SeriesWLCSP
Part NumberW8x12.96
Package Intersil W8x12.96

96 Ball Wafer Level Chip Scale Package (WLCSP 0.5mm Pitch)

Package Outline Drawing (POD)

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Parametrics

FamilyWLCSP-TCURDL
Pin Count96
Length6.11 mm
Width4.03 mm
Thickness0.36 mm
Height max0.66 mm
Pitch0.50 mm
Lead Free Peak Temperature260 °C
Package IndexW8X12.96

Model Line

Manufacturer's Classification

  • Plastic Packages