Package Intersil W8x9.72C

ManufacturerIntersil
SeriesWLCSP
Part NumberW8x9.72C
Package Intersil W8x9.72C

72 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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Parametrics

FamilyWLCSP-BP
Pin Count72
Length3.94 mm
Width3.54 mm
Thickness0.50 mm
Height max0.55 mm
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW8X9.72C

Model Line

Manufacturer's Classification

  • Plastic Packages