Package Intersil W9x11.99

ManufacturerIntersil
SeriesWLCSP
Part NumberW9x11.99
Package Intersil W9x11.99

99 Ball Wafer Level Chip Scale Package (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

PDF, 281 Kb
Extract from the document

Parametrics

FamilyWLCSP-TKCURDL
Pin Count99
Length4.80 mm
Width4.00 mm
Thickness0.50 mm
Height max0.55 mm
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW9X11.99

Model Line

Manufacturer's Classification

  • Plastic Packages