Package Intersil W3x3.9H

Plastic Packages for Integrated Circuits
1. Package Outline Drawing W3x3.9H
9 BALL 3x3 ARRAY ULTRA THIN WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) 0.4mm Pitch
Rev 2, 11/17
X
1.410 В±0.030 Y 0.400 C
1.410 В±0.030 (9x) 0.240 В±0.035 B 0.305 A
(4x) 0.10
1 PIN 1 2 3 (A1 CORNER) TOP VIEW 0.305
BOTTOM VIEW Z
0.05 Z PACKAGE OUTLINE SEATING PLANE
3 0.215 0.400 0.240 В±0.035 4 0.265 0.10 M Z X Y
0.05 M Z
5 6. NSMD RECOMMENDED LAND PATTERN 0.130 В±0.015
0.150 В±0.025
SIDE VIEW NOTES:
1. All dimensions are in millimeters.
2. Dimensions and tolerance per ASME Y14.5 -1994.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Dimension is measured at the maximum bump diameter parallel to primary datum Z .
5. Bump position designation per JESD 95-1, SPP-010.
6. NSMD refers to non-solder mask defined pad design per Intersil tech brief TB451. …