Datasheet Microchip ATA6617C-P3QW-1

ManufacturerMicrochip
SeriesATA6617C
Part NumberATA6617C-P3QW-1

The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks

Datasheets

ATA6616C/ATA6617C - Complete Datasheet
PDF, 8.5 Mb, File published: Jan 1, 2015
Extract from the document

Prices

Status

Lifecycle StatusProduction (Appropriate for new designs but newer alternatives may exist)

Packaging

PackageVQFN
Pins38

Parametrics

DescriptionLIN System-in-Package (SiP) Solution
LIN Specification Supported1.3, 2.0, 2.1, 2.2, SAE J2602-2
Max. Baud Rate20 KBaud
Vcc Range5 - 27 V
Vreg Output Current85 mA
Vreg Output Voltage5.0 V

Eco Plan

RoHSCompliant

Other Options

ATA6616C

Model Line

Series: ATA6617C (1)
  • ATA6617C-P3QW-1

Manufacturer's Classification

  • Interface and Connectivity > LIN > LIN System-in-Package Solution

Other Names:

ATA6617CP3QW1, ATA6617C P3QW 1