Datasheet Microchip ATA6617C

ManufacturerMicrochip
SeriesATA6617C

The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks

Datasheets

ATA6616C/ATA6617C - Complete Datasheet
PDF, 8.5 Mb, File published: Jan 1, 2015
Extract from the document

Prices

Status

ATA6617C-P3QW-1
Lifecycle StatusProduction (Appropriate for new designs but newer alternatives may exist)

Packaging

ATA6617C-P3QW-1
N1
PackageVQFN
Pins38

Parametrics

Parameters / ModelsATA6617C-P3QW-1
DescriptionLIN System-in-Package (SiP) Solution
LIN Specification Supported1.3, 2.0, 2.1, 2.2, SAE J2602-2
Max. Baud Rate, KBaud20
Vcc Range, V5 - 27
Vreg Output Current, mA85
Vreg Output Voltage, V5.0

Eco Plan

ATA6617C-P3QW-1
RoHSCompliant

Other Options

ATA6616C

Model Line

Series: ATA6617C (1)

Manufacturer's Classification

  • Interface and Connectivity > LIN > LIN System-in-Package Solution