Datasheet Microchip ATA6617C
Manufacturer | Microchip |
Series | ATA6617C |
The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks
Datasheets
ATA6616C/ATA6617C - Complete Datasheet
PDF, 8.5 Mb, File published: Jan 1, 2015
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Prices
Status
ATA6617C-P3QW-1 | |
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Lifecycle Status | Production (Appropriate for new designs but newer alternatives may exist) |
Packaging
ATA6617C-P3QW-1 | |
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N | 1 |
Package | VQFN |
Pins | 38 |
Parametrics
Parameters / Models | ATA6617C-P3QW-1 |
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Description | LIN System-in-Package (SiP) Solution |
LIN Specification Supported | 1.3, 2.0, 2.1, 2.2, SAE J2602-2 |
Max. Baud Rate, KBaud | 20 |
Vcc Range, V | 5 - 27 |
Vreg Output Current, mA | 85 |
Vreg Output Voltage, V | 5.0 |
Eco Plan
ATA6617C-P3QW-1 | |
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RoHS | Compliant |
Other Options
Model Line
Series: ATA6617C (1)
Manufacturer's Classification
- Interface and Connectivity > LIN > LIN System-in-Package Solution