DICE SPECIFICATION
RH07 8 1 7 6 2 3 4 PAD FUNCTION DIE CROSS REFERENCE (Notes 1, 2) 1. Offset Adjust
2. –IN
3.+IN
4.V– (Substrate)
5. Do Not Connect
6. OUT
7. V+
8. Offset Adjust LTC Finished
Part Number Order DICE CANDIDATE
Part Number Below RH07 RH07 DICE Backside (substrate) is
an alloyed gold layer.
Connect to V –. 78 × 98 mils W
DICE ELECTRICAL TEST LI ITS VS = ±15V, VCM = 0V, TA = 25°C unless otherwise noted. SYMBOL PARAMETER CONDITIONS VOS Input Offset Voltage 100 µV IOS Input Offset Current 3 nA IB Input Bias Current ±4 nA CMRR Common Mode Rejection Ratio VCM = ±13 105 dB PSRR Power Supply Rejection Ratio VS = ±3V to ±18V 98 dB AVOL Large-Signal Voltage Gain RL ≥ 2k, VO = ±12V 200 V/mV VOUT Maximum Output Voltage Swing RL ≥ 2k
RL ≥ 1k ±11.5
±10.0 SR Slew Rate RL ≥ 2k 0.1 PD Power Dissipation No Load
No Load, VS = В±3V Note 1: Dice are probe tested at 25В°C to the limits shown. Final specs after
assembly cannot be guaranteed at the die level due to yield loss and
assembly shifts. For absolute maximum ratings, typical specifications,
performance curves and finished product specifications, please refer to the
standard data sheet. MIN MAX UNITS V
V
V/Вµs …
