Datasheet MOC3061M, MOC3062M, MOC3063M, MOC3162M, MOC3163M (ON Semiconductor) - 9
| Manufacturer | ON Semiconductor |
| Description | 6-Pin DIP Zero-Cross Triac Driver Optocoupler (600 Volt Peak) |
| Pages / Page | 14 / 9 |
| File Format / Size | PDF / 444 Kb |
| Document Language | English |
Text Version of Document
MOC306XM, MOC316XM — 6-Pin DIP Zero-Cross Triac Driver Optocoupler (600 Volt Peak) Reflow Profile Temperature (°C) TP 260
240
TL
220
200
180
160
140
120
100
80
60
40
20
0 Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S tP
Tsmax tL Preheat Area
Tsmin
ts 240 120 360 Time 25°C to Peak Time (seconds) Profile Freature Pb-Free Assembly Profile Temperature Minimum (Tsmin) 150°C Temperature Maximum (Tsmax) 200°C Time (tS) from (Tsmin to Tsmax) 60 seconds to 120 seconds Ramp-up Rate (TL to TP) 3°C/second maximum Liquidous Temperature (TL) 217°C Time (tL) Maintained Above (TL) 60 seconds to 150 seconds Peak Body Package Temperature 260°C +0°C / –5°C Time (tP) within 5°C of 260°C 30 seconds Ramp-down Rate (TP to TL) 6°C/second maximum Time 25°C to Peak Temperature 8 minutes maximum Figure 14. Reflow Profile ©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.5 www.fairchildsemi.com
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240
TL
220
200
180
160
140
120
100
80
60
40
20
0 Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S tP
Tsmax tL Preheat Area
Tsmin
ts 240 120 360 Time 25°C to Peak Time (seconds) Profile Freature Pb-Free Assembly Profile Temperature Minimum (Tsmin) 150°C Temperature Maximum (Tsmax) 200°C Time (tS) from (Tsmin to Tsmax) 60 seconds to 120 seconds Ramp-up Rate (TL to TP) 3°C/second maximum Liquidous Temperature (TL) 217°C Time (tL) Maintained Above (TL) 60 seconds to 150 seconds Peak Body Package Temperature 260°C +0°C / –5°C Time (tP) within 5°C of 260°C 30 seconds Ramp-down Rate (TP to TL) 6°C/second maximum Time 25°C to Peak Temperature 8 minutes maximum Figure 14. Reflow Profile ©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.5 www.fairchildsemi.com
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