Datasheet XL6009 - 4
| Description | 400KHz 60V 4A Switching Current Boost / Buck-Boost / Inverting DC/DC Converter |
| Pages / Page | 8 / 4 — XL6009. 400KHz 60V 4A Switching Current Boost / Buck-Boost / Inverting … |
| File Format / Size | PDF / 250 Kb |
| Document Language | English |
XL6009. 400KHz 60V 4A Switching Current Boost / Buck-Boost / Inverting DC/DC Converter. Ordering Information. Part Number
Text Version of Document
XL6009 400KHz 60V 4A Switching Current Boost / Buck-Boost / Inverting DC/DC Converter Ordering Information Part Number Marking ID Packing Type Temperature Lead Free Lead Free Package Range
XL6009E1 XL6009E1 Tube XL6009TRE1 XL6009E1 Tape & Reel XLSEMI Pb-free products, as designated with “E1” suffix in the par number, are RoHS compliant.
Absolute Maximum Ratings（Note1） Parameter Symbol Value Unit
Input Voltage Vin -0.3 to 36 V Feedback Pin Voltage VFB -0.3 to Vin V EN Pin Voltage VEN -0.3 to Vin V Output Switch Pin Voltage VOutput -0.3 to 60 V Power Dissipation PD Internally limited mW Thermal Resistance (TO263-5L) R (Junction to Ambient, No Heatsink, Free Air) JA 30 ºC/W Operating Junction Temperature TJ -40 to 125 ºC Storage Temperature TSTG -65 to 150 ºC Lead Temperature (Soldering, 10 sec) TLEAD 260 ºC ESD (HBM) >2000 V
Note1:
Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Rev 1.1 www.xlsemi.com 4
XL6009E1 XL6009E1 Tube XL6009TRE1 XL6009E1 Tape & Reel XLSEMI Pb-free products, as designated with “E1” suffix in the par number, are RoHS compliant.
Absolute Maximum Ratings（Note1） Parameter Symbol Value Unit
Input Voltage Vin -0.3 to 36 V Feedback Pin Voltage VFB -0.3 to Vin V EN Pin Voltage VEN -0.3 to Vin V Output Switch Pin Voltage VOutput -0.3 to 60 V Power Dissipation PD Internally limited mW Thermal Resistance (TO263-5L) R (Junction to Ambient, No Heatsink, Free Air) JA 30 ºC/W Operating Junction Temperature TJ -40 to 125 ºC Storage Temperature TSTG -65 to 150 ºC Lead Temperature (Soldering, 10 sec) TLEAD 260 ºC ESD (HBM) >2000 V
Note1:
Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Rev 1.1 www.xlsemi.com 4
