Datasheet LTC6104 (Analog Devices) - 15
| Manufacturer | Analog Devices |
| Description | High Voltage, High Side, Bi-Directional Current Sense Amplifier |
| Pages / Page | 16 / 15 — PACKAGE DESCRIPTION. MS8 Package. 8-Lead Plastic MSOP |
| File Format / Size | PDF / 317 Kb |
| Document Language | English |
PACKAGE DESCRIPTION. MS8 Package. 8-Lead Plastic MSOP
Model Line for this Datasheet
Text Version of Document
LTC6104
PACKAGE DESCRIPTION MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660) 0.889 ± 0.127 (.035 ± .005) 5.23 (.206) 3.20 – 3.45 MIN (.126 – .136) 3.00 ± 0.102 (.118 0.42 ± 0.038 0.65 ± .004) 0.52 (.0165 ± .0015) (.0256) (NOTE 3) 8 7 6 5 (.0205) TYP BSC REF RECOMMENDED SOLDER PAD LAYOUT 3.00 ± 0.102 4.90 ± 0.152 DETAIL “A” (.118 ± .004) 0.254 (.193 ± .006) (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 1 2 3 4 0.53 ± 0.152 (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.22 – 0.38 0.127 ± 0.076 (.009 – .015) (.005 ± .003) TYP 0.65 MSOP (MS8) 0204 (.0256) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6104f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15
PACKAGE DESCRIPTION MS8 Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660) 0.889 ± 0.127 (.035 ± .005) 5.23 (.206) 3.20 – 3.45 MIN (.126 – .136) 3.00 ± 0.102 (.118 0.42 ± 0.038 0.65 ± .004) 0.52 (.0165 ± .0015) (.0256) (NOTE 3) 8 7 6 5 (.0205) TYP BSC REF RECOMMENDED SOLDER PAD LAYOUT 3.00 ± 0.102 4.90 ± 0.152 DETAIL “A” (.118 ± .004) 0.254 (.193 ± .006) (NOTE 4) (.010) 0° – 6° TYP GAUGE PLANE 1 2 3 4 0.53 ± 0.152 (.021 ± .006) 1.10 0.86 (.043) (.034) DETAIL “A” MAX REF 0.18 (.007) SEATING PLANE 0.22 – 0.38 0.127 ± 0.076 (.009 – .015) (.005 ± .003) TYP 0.65 MSOP (MS8) 0204 (.0256) NOTE: BSC 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 6104f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 15
