Datasheet MIC7111 (Microchip) - 3

Micrel, Inc. MIC7111 Absolute Maximum Ratings(1) Operating Ratings(2) Supply Voltage (VV+ − VV−) . +12V
Differential Input Voltage (VIN+ − VIN−) ±(VV+ − VV−)
(3)
I/O Pin Voltage (VIN, VOUT) .VV+ + 0.3V to VV− − 0.3V
Junction Temperature (TJ) . +150°C
Lead Temperature (soldering, 10s) . 260°C
Storage Temperature (Ts). −65°C to +150°C
(6)
ESD Rating . 2kV Supply Voltage (VV+ − VV−) . +1.8V to +11V
Junction Temperature (TJ) . –40°C to +85°C
(4)
Maximum Junction Temperature (TJ(MAX) . +85°C
(5)
Package Thermal Resistance (θJA) . +252°C/W
Maximum Power Dissipation . Note 4 DC Electrical Characteristics
VV+ = +1.8V; VV− = 0V; VCM = VOUT = VV+/2; RL = 1M; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +85°C, unless noted.
Symbol Parameter Condition VOS Input Offset Voltage TCVOS Input Offset Voltage Temperature Drift IB Input Bias Current IOS Input Offset Current RIN Input Resistance +PSRR Positive Power Supply Rejection Ratio 1.8V ≤ VV+ ≤ 5V, VV− = 0V,
VCM = VOUT = 0.9V −PSRR Negative Power Supply Rejection Ratio CMRR Common-Mode Rejection Ratio CIN Common-Mode Input Capacitance Typ. Max. 0.9 7
9 2.0
1 0.01 Units
mV
µV/°C 10
500
0.5
75 pA pA >10 TΩ 60 85 dB −1.8V ≤ VV− ≤ −5V, VV+ = 0V,
VCM = VOUT = −0.9V 60 85 dB VCM = −0.2V to +2.0V 50 70 dB 3 pF Output HIGH, RL = 100k,
Specified as VV+ −VOUT
Output LOW, RL = 100k
VOUT Min. Output Voltage Swing
Output HIGH, RL = 2k,
Specified as VV+ − VOUT
Output LOW, RL = 2k 0.14 1
1 0.14 1
1 6.8 23 mV 34
6.8 23
34 Notes:
1. Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating
the device outside its recommended operating ratings.
2. The device is not guaranteed to function outside its operating ratings. 3. I/O pin voltage is any external voltage to which an input or output is referenced. 4. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX); the junction-to-ambient thermal resistance,
θJA; and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using PD = (TJ(MAX) − TA)
÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature. 5. Thermal resistance, θJA, applies to a part soldered on a printed-circuit board. 6. Devices are ESD protected, however, handling precautions are recommended. All limits guaranteed by testing on statistical analysis. Human body
model, 1.5kΩ in series with 100pF. February 11, 2013 3 Revision 2.0