Datasheet MCP6L71, MCP6L71R, MCP6L72, MCP6L74 (Microchip)

ManufacturerMicrochip
DescriptionThe MCP6L71 operational amplifier has 2MHz Gain Bandwidth Product and a low 150uA per amplifier quiescent current
Pages / Page32 / 1 — MCP6L71/1R/2/4. 2 MHz, 150 µA Op Amps. Features. Description. Typical …
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MCP6L71/1R/2/4. 2 MHz, 150 µA Op Amps. Features. Description. Typical Applications. Package Types. MCP6L71. MCP6L71R. Design Aids

Datasheet MCP6L71, MCP6L71R, MCP6L72, MCP6L74 Microchip

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MCP6L71/1R/2/4 2 MHz, 150 µA Op Amps Features Description
• Gain Bandwidth Product: 2 MHz (typical) The Microchip Technology Inc. MCP6L71/1R/2/4 family • Supply Current: IQ = 150 µA (typical) of operational amplifiers (op amps) supports general • Supply Voltage: 2.0V to 6.0V purpose applications. The combination of rail-to-rail • Rail-to-Rail Input/Output input and output, low quiescent current and bandwidth fit into many applicaitons. • Extended Temperature Range: –40°C to +125°C • Available in Single, Dual and Quad Packages This family has a 2 MHz Gain Bandwidth Product (GBWP) and a low 150 µA per amplifier quiescent cur-
Typical Applications
rent. These op amps operate on supply voltages between 2.0V and 6.0V, with rail-to-rail input and output • Portable Equipment swing. They are available in the extended temperature • Photodiode Amplifier range. • Analog Filters • Notebooks and PDAs
Package Types
• Battery Powered Systems
MCP6L71 MCP6L71R Design Aids SOT-23-5 SOT-23-5
• FilterLab® Software V 1 5 V V 1 5 V • MAPS (Microchip Advanced Part Selector) OUT DD OUT SS V 2 V 2 • Analog Demonstration and Evaluation Boards SS DD V 3 4 V 3 4 • Application Notes IN+ VIN– IN+ VIN–
Typical Application MCP6L71 MCP6L72 SOIC, MSOP SOIC, MSOP
R1 R2 V NC 1 8 NC V 1 8 V OUTA IN VOUT DD VIN– 2 7 VDD VINA– 2 7 VOUTB R3 V 3 6 IN+ VOUT V 3 6 INA+ VINB– VREF
MCP6L71
V 4 5 NC SS V 4 5 V SS INB+
Inverting Amplifier MCP6L74 SOIC, TSSOP
V 1 14 V OUTA OUTD VINA– 2 13 VIND– V 3 12 INA+ VIND+ V 4 11 V DD SS V 5 10 INB+ VINC+ VINB– 6 9 VINC– VOUTB 7 8 VOUTC © 2009 Microchip Technology Inc. DS22145A-page 1 Document Outline 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC Electrical Specifications (Continued) TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 2.0V. FIGURE 2-2: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 5.5V. FIGURE 2-3: Input Offset Voltage vs. Output Voltage. FIGURE 2-4: Input Common Mode Range Voltage vs. Ambient Temperature. FIGURE 2-5: CMRR, PSRR vs. Temperature. FIGURE 2-6: CMRR, PSRR vs. Frequency. FIGURE 2-7: Input Current vs. Input Voltage. FIGURE 2-8: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-9: Input Noise Voltage Density vs. Frequency. FIGURE 2-10: The MCP6L71/1R/2/4 Show No Phase Reversal. FIGURE 2-11: Quiescent Current vs. Supply Voltage. FIGURE 2-12: Output Short Circuit Current vs. Supply Voltage. FIGURE 2-13: Ratio of Output Voltage Headroom vs. Output Current Magnitude. FIGURE 2-14: Large Signal Non-inverting Pulse Response. FIGURE 2-15: Small Signal Non-inverting Pulse Response. FIGURE 2-16: Slew Rate vs. Ambient Temperature. FIGURE 2-17: Maximum Output Voltage Swing vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table for Single Op Amps TABLE 3-2: Pin Function Table for Dual and Quad Op Amps 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 4.0 Application Information 4.1 Rail-to-Rail Inputs FIGURE 4-1: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-2: Output Resistor, RISO Stabilizes Large Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Amplifiers FIGURE 4-3: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-4: Example Guard Ring Layout. 4.7 Application Circuits FIGURE 4-5: Inverting Integrator. 5.0 Design Tools 5.1 FilterLab® Software 5.2 MAPS (Microchip Advanced Part Selector) 5.3 Analog Demonstration and Evaluation Boards 5.4 Application Notes 6.0 Packaging Information 6.1 Package Marking Information