Datasheet ADA4896-2, ADA4897-1, ADA4897-2 (Analog Devices) - 8
| Manufacturer | Analog Devices |
| Description | 1 nV/√Hz, Low Power Operational Amplifier |
| Pages / Page | 28 / 8 — ADA4896-2/ADA4897-1/ADA4897-2. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table … |
| Revision | B |
| File Format / Size | PDF / 686 Kb |
| Document Language | English |
ADA4896-2/ADA4897-1/ADA4897-2. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Rating. THERMAL RESISTANCE. 3.5. TJ = 150°C
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ADA4896-2/ADA4897-1/ADA4897-2 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 6.
The quiescent power dissipation is the voltage between the supply pins (±V
Parameter Rating
S) multiplied by the quiescent current (IS). Supply Voltage 11 V PD = Quiescent Power + (Total Drive Power − Load Power) Power Dissipation See Figure 3 V V V 2 Common-Mode Input Voltage −V P V I D S S S OUT OUT S − 0.7 V to +VS + 0.7 V 2 R R Differential Input Voltage 0.7 V L L Storage Temperature Range −65°C to +125°C RMS output voltages should be considered. If RL is referenced to Operating Temperature Range −40°C to +125°C −VS, as in single-supply operation, the total drive power is VS × Lead Temperature (Soldering 10 sec) 300°C IOUT. If the rms signal levels are indeterminate, consider the worst Junction Temperature 150°C case, when VOUT = VS/4 for RL to midsupply. 2 Stresses above those listed under Absolute Maximum Ratings V / 4 P V I D S S S may cause permanent damage to the device. This is a stress RL rating only; functional operation of the device at these or any In single-supply operation with RL referenced to −VS, worst case other conditions above those indicated in the operational is VOUT = VS/2. section of this specification is not implied. Exposure to absolute Airflow increases heat dissipation, effectively reducing θ maximum rating conditions for extended periods may affect JA. Also, more metal directly in contact with the package leads device reliability. and exposed paddle from metal traces, through holes, ground,
THERMAL RESISTANCE
and power planes reduces θJA. θJA is specified for the worst-case conditions, that is, θJA is Figure 3 shows the maximum safe power dissipation in the specified for a device soldered in a circuit board for surface- package vs. the ambient temperature on a JEDEC standard mount packages. Table 7 lists the θJA for the ADA4896-2/ 4-layer board. θJA values are approximations. ADA4897-1/ADA4897-2.
3.5 TJ = 150°C Table 7. Thermal Resistance ) 3.0 Package Type θ W JA Unit (
8-Lead Dual MSOP (ADA4896-2) 222 °C/W
ON 2.5 TI A
8-Lead Dual LFCSP (ADA4896-2) 61 °C/W
P ISSI 2.0
8-Lead Single SOIC (ADA4897-1) 133 °C/W
8-LEAD LFCSP D R
6-Lead Single SOT-23 (ADA4897-1) 150 °C/W
E 6-LEAD SOT-23 W 1.5
10-Lead Dual MSOP (ADA4897-2) 210 °C/W
10-LEAD MSOP M PO 1.0 8-LEAD SOIC MU MAXIMUM POWER DISSIPATION XI MA 0.5
The maximum safe power dissipation for the ADA4896-2/
8-LEAD MSOP
ADA4897-1/ADA4897-2 is limited by the associated rise in
0
junction temperature (T
–45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85 95 105 115 125
053 J) on the die. At approximately 150C, 47-
AMBIENT TEMPERATURE (°C)
which is the glass transition temperature, the properties of the 094 Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board plastic change. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the
ESD CAUTION
die, permanently shifting the parametric performance of the ADA4896-2/ADA4897-1/ADA4897-2. Exceeding a junction temperature of 175C for an extended period of time can result in changes in silicon devices, potentially causing degradation or loss of functionality. The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the die due to the ADA4896-2/ADA4897-1/ADA4897-2 drive at the output. Rev. B | Page 8 of 28 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±5 V SUPPLY +5 V SUPPLY +3 V SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION AMPLIFIER DESCRIPTION INPUT PROTECTION DISABLE OPERATION DC ERRORS BIAS CURRENT CANCELLATION NOISE CONSIDERATIONS CAPACITANCE DRIVE APPLICATIONS INFORMATION TYPICAL PERFORMANCE VALUES LOW NOISE, GAIN SELECTABLE AMPLIFIER MEDICAL ULTRASOUND APPLICATIONS Overview of the Ultrasound System ADA4896-2/ADA4897-1/ADA4897-2 in the Ultrasound System LAYOUT CONSIDERATIONS Ground Plane Power Supply Bypassing OUTLINE DIMENSIONS ORDERING GUIDE
ADA4896-2/ADA4897-1/ADA4897-2 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 6.
The quiescent power dissipation is the voltage between the supply pins (±V
Parameter Rating
S) multiplied by the quiescent current (IS). Supply Voltage 11 V PD = Quiescent Power + (Total Drive Power − Load Power) Power Dissipation See Figure 3 V V V 2 Common-Mode Input Voltage −V P V I D S S S OUT OUT S − 0.7 V to +VS + 0.7 V 2 R R Differential Input Voltage 0.7 V L L Storage Temperature Range −65°C to +125°C RMS output voltages should be considered. If RL is referenced to Operating Temperature Range −40°C to +125°C −VS, as in single-supply operation, the total drive power is VS × Lead Temperature (Soldering 10 sec) 300°C IOUT. If the rms signal levels are indeterminate, consider the worst Junction Temperature 150°C case, when VOUT = VS/4 for RL to midsupply. 2 Stresses above those listed under Absolute Maximum Ratings V / 4 P V I D S S S may cause permanent damage to the device. This is a stress RL rating only; functional operation of the device at these or any In single-supply operation with RL referenced to −VS, worst case other conditions above those indicated in the operational is VOUT = VS/2. section of this specification is not implied. Exposure to absolute Airflow increases heat dissipation, effectively reducing θ maximum rating conditions for extended periods may affect JA. Also, more metal directly in contact with the package leads device reliability. and exposed paddle from metal traces, through holes, ground,
THERMAL RESISTANCE
and power planes reduces θJA. θJA is specified for the worst-case conditions, that is, θJA is Figure 3 shows the maximum safe power dissipation in the specified for a device soldered in a circuit board for surface- package vs. the ambient temperature on a JEDEC standard mount packages. Table 7 lists the θJA for the ADA4896-2/ 4-layer board. θJA values are approximations. ADA4897-1/ADA4897-2.
3.5 TJ = 150°C Table 7. Thermal Resistance ) 3.0 Package Type θ W JA Unit (
8-Lead Dual MSOP (ADA4896-2) 222 °C/W
ON 2.5 TI A
8-Lead Dual LFCSP (ADA4896-2) 61 °C/W
P ISSI 2.0
8-Lead Single SOIC (ADA4897-1) 133 °C/W
8-LEAD LFCSP D R
6-Lead Single SOT-23 (ADA4897-1) 150 °C/W
E 6-LEAD SOT-23 W 1.5
10-Lead Dual MSOP (ADA4897-2) 210 °C/W
10-LEAD MSOP M PO 1.0 8-LEAD SOIC MU MAXIMUM POWER DISSIPATION XI MA 0.5
The maximum safe power dissipation for the ADA4896-2/
8-LEAD MSOP
ADA4897-1/ADA4897-2 is limited by the associated rise in
0
junction temperature (T
–45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85 95 105 115 125
053 J) on the die. At approximately 150C, 47-
AMBIENT TEMPERATURE (°C)
which is the glass transition temperature, the properties of the 094 Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board plastic change. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the
ESD CAUTION
die, permanently shifting the parametric performance of the ADA4896-2/ADA4897-1/ADA4897-2. Exceeding a junction temperature of 175C for an extended period of time can result in changes in silicon devices, potentially causing degradation or loss of functionality. The power dissipated in the package (PD) is the sum of the quiescent power dissipation and the power dissipated in the die due to the ADA4896-2/ADA4897-1/ADA4897-2 drive at the output. Rev. B | Page 8 of 28 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±5 V SUPPLY +5 V SUPPLY +3 V SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION AMPLIFIER DESCRIPTION INPUT PROTECTION DISABLE OPERATION DC ERRORS BIAS CURRENT CANCELLATION NOISE CONSIDERATIONS CAPACITANCE DRIVE APPLICATIONS INFORMATION TYPICAL PERFORMANCE VALUES LOW NOISE, GAIN SELECTABLE AMPLIFIER MEDICAL ULTRASOUND APPLICATIONS Overview of the Ultrasound System ADA4896-2/ADA4897-1/ADA4897-2 in the Ultrasound System LAYOUT CONSIDERATIONS Ground Plane Power Supply Bypassing OUTLINE DIMENSIONS ORDERING GUIDE
