Datasheet AD8663, AD8667, AD8669 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Low Noise, Precision, 16 V, CMOS, Rail-to-Rail Operational Amplifiers |
| Pages / Page | 15 / 5 — Data Sheet. AD8663/AD8667/AD8669. ABSOLUTE MAXIMUM RATINGS Table 3. … |
| Revision | D |
| File Format / Size | PDF / 666 Kb |
| Document Language | English |
Data Sheet. AD8663/AD8667/AD8669. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE. Parameter. Rating
Model Line for this Datasheet
Text Version of Document
Data Sheet AD8663/AD8667/AD8669 ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Supply Voltage 18 V soldered in a circuit board for surface-mount packages. Input Voltage −0.1 V to VSY Differential Input Voltage 18 V
Table 4. Thermal Resistance
Output Short-Circuit Duration to GND Indefinite
Package Type θJA θJC Unit
Storage Temperature Range −60°C to +150°C 8-Lead SOIC (R-8) 121 43 °C/W Operating Temperature Range −40°C to +125°C 8-Lead LFCSP (CP-8-13) 751 181 °C/W Junction Temperature Range −65°C to +150°C 8-Lead MSOP (RM-8) 145 45 °C/W Lead Temperature, Soldering (60 sec) 300°C 14-Lead SOIC (R-14) 90 45 °C/W 14-Lead TSSOP (RU-14) 180 35 °C/W Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a 1 Exposed pad soldered to application board. stress rating only; functional operation of the product at these
ESD CAUTION
or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. D | Page 5 of 15 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for the worst-case conditions, that is, a device Supply Voltage 18 V soldered in a circuit board for surface-mount packages. Input Voltage −0.1 V to VSY Differential Input Voltage 18 V
Table 4. Thermal Resistance
Output Short-Circuit Duration to GND Indefinite
Package Type θJA θJC Unit
Storage Temperature Range −60°C to +150°C 8-Lead SOIC (R-8) 121 43 °C/W Operating Temperature Range −40°C to +125°C 8-Lead LFCSP (CP-8-13) 751 181 °C/W Junction Temperature Range −65°C to +150°C 8-Lead MSOP (RM-8) 145 45 °C/W Lead Temperature, Soldering (60 sec) 300°C 14-Lead SOIC (R-14) 90 45 °C/W 14-Lead TSSOP (RU-14) 180 35 °C/W Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a 1 Exposed pad soldered to application board. stress rating only; functional operation of the product at these
ESD CAUTION
or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. D | Page 5 of 15 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
