Datasheet ADA4850-1, ADA4850-2 (Analog Devices) - 5

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Data Sheet ADA4850-1/ADA4850-2 ABSOLUTE MAXIMUM RATINGS
The power dissipated in the package (PD) is the sum of the
Table 3.
quiescent power dissipation and the power dissipated in the die
Parameter Rating
due to the ADA4850-1/ADA4850-2 drive at the output. The Supply Voltage 12.6 V quiescent power is the voltage between the supply pins (VS) Power Dissipation See Figure 4 times the quiescent current (IS). Power Down Pin Voltage (−VS + 6) V P Common-Mode Input Voltage Range (−V D = Quiescent Power + (Total Drive Power − Load Power) S − 0.5 ) V to (+VS + 0.5) V Differential Input Voltage Range +VS to −VS 2   P = (V × I ) VS OU V T OU V T Storage Temperature Range −65°C to +125°C + × − D S S   2 R  R Operating Temperature Range −40°C to +125°C L L Lead Temperature Range 300°C Consider rms output voltages. If RL is referenced to −VS, as in (Soldering 10 sec) single-supply operation, the total drive power is VS × IOUT. If the Junction Temperature 150°C rms signal levels are indeterminate, consider the worst case, when VOUT = VS/4 for RL to midsupply. Stresses at or above those listed under Absolute Maximum 2 Ratings may cause permanent damage to the product. This is a V /4 = × + D P (V I ) ( ) S stress rating only; functional operation of the product at these S S RL or any other conditions above those indicated in the operational In single-supply operation with RL referenced to −VS, the worst section of this specification is not implied. Operation beyond case is VOUT = VS/2. the maximum operating conditions for extended periods may affect product reliability. Airflow increases heat dissipation, effectively reducing θJA. In addition, more metal directly in contact with the package leads
THERMAL RESISTANCE
and exposed paddle from metal traces through holes, ground, θJA is specified for the worst-case conditions, that is, θJA is specified and power planes reduce θJA. for the device soldered in the circuit board for surface-mount Figure 4 shows the maximum safe power dissipation in the packages. package vs. the ambient temperature for the LFCSP (91°C/W)
Table 4.
package on a JEDEC standard 4-layer board. θJA values are
Package Type θ
approximations.
JA Unit
16-Lead LFCSP 72.8 °C/W
3.0 TJ = 150°C
8-Lead LFCSP 80 °C/W
) 2.5 (W Maximum Power Dissipation N IO T LFCSP-16
The maximum safe power dissipation for the ADA4850-1/
2.0 PA
ADA4850-2 is limited by the associated rise in junction
ISSI D LFCSP-8
temperature (T
1.5
J) on the die. At approximately 150°C, which
ER W
is the glass transition temperature, the plastic changes its properties. Even temporarily exceeding this temperature limit
M PO 1.0 MU
may change the stresses that the package exerts on the die,
XI
permanently shifting the parametric performance of the
MA 0.5
ADA4850-1/ADA4850-2. Exceeding a junction temperature
0
of 150°C for an extended period of time can result in changes
–55 –45 –35 –25 –15 –5 5 15 25 35 45 55 65 75 85 95 105 115 125
055 in silicon devices, potentially causing degradation or loss of
AMBIENT TEMPERATURE (
°
C)
05320- functionality. Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
Rev. D | Page 5 of 14 Document Outline FEATURES APPLICATIONS PIN CONFIGURATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS SPECIFICATIONS WITH +3 V SUPPLY SPECIFICATIONS WITH +5 V SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Maximum Power Dissipation ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS CIRCUIT DESCRIPTION HEADROOM AND OVERDRIVE RECOVERY CONSIDERATIONS Input Output OPERATING THE ADA4850-1/ADA4850-2 ON BIPOLAR SUPPLIES POWER-DOWN PINS OUTLINE DIMENSIONS ORDERING GUIDE