LT1117/LT1117-2.85 LT1117-3.3/LT1117-5 APPLICATIONS INFORMATION Experiments have shown that the heat spreading copper The power dissipation of the LT1117 is equal to: layer does not need to be electrically connected to the P tab of the device. The PC material can be very effective at D = ( VIN – VOUT )( IOUT ) transmitting heat between the pad area, attached to the Maximum junction temperature will be equal to: tab of the device, and a ground plane layer either inside TJ = TA(MAX) + PD (Thermal Resistance (junction-to- or on the opposite side of the board. Although the actual ambient)) thermal resistance of the PC material is high, the Length/ Area ratio of the thermal resistor between layers is small. Maximum junction temperature must not exceed 125°C. The data in Table 1 was taken using 1/16" FR-4 board with Ripple Rejection 1oz. copper foil. It can be used as a rough guideline in estimating thermal resistance. The curves for Ripple Rejection were generated using an adjustable device with the adjust pin bypassed. These Table 1. curves will hold true for all values of output voltage. For COPPER AREATHERMAL RESISTANCE proper bypassing, and ripple rejection approaching the TOPSIDE*BACKSIDEBOARD AREA (JUNCTION-TO-AMBIENT) values shown, the impedance of the adjust pin capacitor, 2500 Sq. mm 2500 Sq. mm 2500 Sq. mm 45°C/W at the ripple frequency, should be < R1. R1 is normally in 1000 Sq. mm 2500 Sq. mm 2500 Sq. mm 45°C/W the range of 100Ω to 200Ω. The size of the required adjust 225 Sq. mm 2500 Sq. mm 2500 Sq. mm 53°C/W pin capacitor is a function of the input ripple frequency. At 100 Sq. mm 2500 Sq. mm 2500 Sq. mm 59°C/W 120Hz, with R1 = 100Ω, the adjust pin capacitor should 1000 Sq. mm 1000 Sq. mm 1000 Sq. mm 52°C/W be >13μF. At 10kHz only 0.16μF is needed. 1000 Sq. mm 0 1000 Sq. mm 55°C/W For fixed voltage devices, and adjustable devices without * Tab of device attached to topside copper an adjust pin capacitor, the output ripple will increase as The thermal resistance for each application will be the ratio of the output voltage to the reference voltage affected by thermal interactions with other components (VOUT/VREF). For example, with the output voltage equal on the board. Some experimentation will be necessary to to 5V, the output ripple will be increased by the ratio of determine the actual value. 5V/1.25V. It will increase by a factor of four. Ripple rejection will be degraded by 12dB from the value shown on the curve. 1117fd 9