Datasheet LT1118, LT1118-2.5, LT1118-2.85, LT1118-5 (Analog Devices) - 7
| Manufacturer | Analog Devices |
| Description | Low IQ, Low Dropout, 800mA, Source and Sink Regulators Adjustable and Fixed 2.5V, 2.85V, 5V Output |
| Pages / Page | 8 / 7 — PACKAGE DESCRIPTION. ST Package. 3-Lead Plastic SOT-223. S8 Package. … |
| File Format / Size | PDF / 253 Kb |
| Document Language | English |
PACKAGE DESCRIPTION. ST Package. 3-Lead Plastic SOT-223. S8 Package. 8-Lead Plastic Small Outline (Narrow 0.150)
Model Line for this Datasheet
- LT1118CS8#PBF LT1118CS8#PBF LT1118CS8#TRPBF LT1118CS8#TRPBF LT1118CS8-2.5#PBF LT1118CS8-2.5#PBF LT1118CS8-2.5#TRPBF LT1118CS8-2.5#TRPBF LT1118CS8-2.85#PBF LT1118CS8-2.85#PBF LT1118CS8-2.85#TRPBF LT1118CS8-2.85#TRPBF LT1118CS8-5#PBF LT1118CS8-5#PBF LT1118CS8-5#TRPBF LT1118CS8-5#TRPBF LT1118CST-2.5#PBF LT1118CST-2.5#PBF LT1118CST-2.5#TRPBF LT1118CST-2.5#TRPBF LT1118CST-2.85#PBF LT1118CST-2.85#PBF LT1118CST-2.85#TRPBF LT1118CST-2.85#TRPBF LT1118CST-5#PBF LT1118CST-5#PBF LT1118CST-5#TRPBF LT1118CST-5#TRPBF
Text Version of Document
LT1118/LT1118-2.5 LT1118-2.85/LT1118-5
PACKAGE DESCRIPTION ST Package 3-Lead Plastic SOT-223
(Reference LTC DWG # 05-08-1630) .248 – .264 .129 MAX (6.30 – 6.71) .114 – .124 (2.90 – 3.15) .059 MAX .264 – .287 .248 BSC (6.70 – 7.30) .130 – .146 (3.30 – 3.71) .039 MAX .059 MAX .090 BSC .181 MAX .0905 .033 – .041 RECOMMENDED SOLDER PAD LAYOUT (2.30) (0.84 – 1.04) BSC 10° – 16° .010 – .014 .071 10° (0.25 – 0.36) (1.80) MAX MAX 10° – 16° .024 – .033 .0008 – .0040 .012 (0.60 – 0.84) (0.31) (0.0203 – 0.1016) .181 MIN ST3 (SOT-233) 0502 (4.60) BSC
S8 Package 8-Lead Plastic Small Outline (Narrow 0.150)
(Reference LTC DWG # 05-08-1610) .189 – .197 (4.801 – 5.004) .045 ±.005 NOTE 3 .050 BSC 8 7 6 5 .245 MIN .160 ±.005 .150 – .157 .228 – .244 (3.810 – 3.988) (5.791 – 6.197) NOTE 3 .030 ±.005 TYP 1 2 3 4 RECOMMENDED SOLDER PAD LAYOUT .010 – .020 × 45° .053 – .069 (0.254 – 0.508) (1.346 – 1.752) .004 – .010 .008 – .010 0 (0.101 – 0.254) (0.203 – 0.254) °– 8° TYP .016 – .050 .014 – .019 .050 (0.406 – 1.270) (0.355 – 0.483) (1.270) NOTE: TYP BSC INCHES 1. DIMENSIONS IN (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0303 1118fd Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 7
PACKAGE DESCRIPTION ST Package 3-Lead Plastic SOT-223
(Reference LTC DWG # 05-08-1630) .248 – .264 .129 MAX (6.30 – 6.71) .114 – .124 (2.90 – 3.15) .059 MAX .264 – .287 .248 BSC (6.70 – 7.30) .130 – .146 (3.30 – 3.71) .039 MAX .059 MAX .090 BSC .181 MAX .0905 .033 – .041 RECOMMENDED SOLDER PAD LAYOUT (2.30) (0.84 – 1.04) BSC 10° – 16° .010 – .014 .071 10° (0.25 – 0.36) (1.80) MAX MAX 10° – 16° .024 – .033 .0008 – .0040 .012 (0.60 – 0.84) (0.31) (0.0203 – 0.1016) .181 MIN ST3 (SOT-233) 0502 (4.60) BSC
S8 Package 8-Lead Plastic Small Outline (Narrow 0.150)
(Reference LTC DWG # 05-08-1610) .189 – .197 (4.801 – 5.004) .045 ±.005 NOTE 3 .050 BSC 8 7 6 5 .245 MIN .160 ±.005 .150 – .157 .228 – .244 (3.810 – 3.988) (5.791 – 6.197) NOTE 3 .030 ±.005 TYP 1 2 3 4 RECOMMENDED SOLDER PAD LAYOUT .010 – .020 × 45° .053 – .069 (0.254 – 0.508) (1.346 – 1.752) .004 – .010 .008 – .010 0 (0.101 – 0.254) (0.203 – 0.254) °– 8° TYP .016 – .050 .014 – .019 .050 (0.406 – 1.270) (0.355 – 0.483) (1.270) NOTE: TYP BSC INCHES 1. DIMENSIONS IN (MILLIMETERS) 2. DRAWING NOT TO SCALE 3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 0303 1118fd Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 7
