AD7989-1/AD7989-5Data SheetOUTLINE DIMENSIONS3.10 3.00 2.901065.153.104.903.004.6512.905PIN 1IDENTIFIER0.50 BSC0.9515° MAX0.851.10 MAX0.750.700.156°0.230.550.300.050°0.130.400.15COPLANARITY0.10-A 9 0 7 1COMPLIANT TO JEDEC STANDARDS MO-187-BA9 0 Figure 41. 10-Lead Mini Small Outline Package [MSOP] (RM-10) Dimensions shown in millimeters 2.48 2.383.102.233.00 SQ0.50 BSC2.90610PIN 1 INDEXEXPOSED1.74AREAPAD1.640.501.490.40 0.300.20 MIN15TOP VIEWBOTTOM VIEWPIN 1 INDICATOR (R 0.15)0.80FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO0.750.05 MAXTHE PIN CONFIGURATION AND0.700.02 NOMFUNCTION DESCRIPTIONSCOPLANARITYSECTION OF THIS DATA SHEET.SEATING0.080.30CPLANE0.250.20 REF2013-0.2005-02- Figure 42. 10-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body, Very Very Thin, Dual Lead (CP-10-9) Dimensions shown in millimeters Rev. B | Page 22 of 24 Document Outline Features Applications General Description Typical Applications Circuit Revision History Specifications Timing Specifications Absolute Maximum Ratings ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Terminology Theory of Operation Circuit Information Converter Operation Transfer Functions Typical Connection Diagram Analog Inputs Driver Amplifier Choice Single-Ended to Differential Driver Voltage Reference Input Power Supply Digital Interface CSB Mode, 3-Wire CSB Mode, 4-Wire Chain Mode Applications Information Interfacing to Blackfin® DSP Layout Evaluating AD7989-1/AD7989-5 Performance Outline Dimensions Ordering Guide