Datasheet AD9236 (Analog Devices) - 10

Data Sheet AD9236 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS T B DD ND ND N– DD F F I N+I AV AG V V AG AV RE RE OTR 1 28 D11 (MSB) 32 31 30 29 28 27 26 25 MODE 2 27 D10 SENSE 3 26 D9 DNC 1 24 VREF CLK 2 23 SENSE VREF 4 25 D8 DNC 3 22 MODE AD9236 REFB 5 24 DRVDD PDWN 4 21 OTR TOP VIEW DNC 5 20 D11 (MSB) REFT 6 23 DGND (Not to Scale) AD9236 DNC 6 19 D10 AVDD 7 22 D7 (LSB) D0 7 18 D9 TOP VIEW D1 8 17 D8 AGND 8 (Not to Scale) 21 D6 VIN+ 9 20 D5 9 10 11 12 13 14 15 16 VIN– 10 19 D4 D2 D3 D4 D5 D6 D7 ND DD AGND 11 18 D3 DG DRV NOTES AVDD 12 17 D2 1. DNC = DO NOT CONNECT. 2. IT IS RECOMMENDED THAT THE EXPOSED PADDLE BE CLK 13 16 D1 SOLDERED TO THE GROUND PLANE FOR THE LFCSP. THERE IS AN INCREASED RELIABILITY OF THE SOLDER JOINTS, AND PDWN 14 15 D0 (LSB) THE MAXIMUM THERMAL CAPABILITY OF THE PACKAGE IS ACHIEVED WITH THE EXPOSED PADDLE SOLDERED TO THE
03066-0-021
CUSTOMER BOARD.
03066-0-022 Figure 3. 28-Lead TSSOP Figure 4. 32-Lead LFCSP
Table 8. Pin Function Descriptions—28-Lead TSSOP Table 9. Pin Function Descriptions—32-Lead LFCSP Pin No. Mnemonic Description Pin No. Mnemonic Description
1 OTR Out-of-Range Indicator 1, 3, 5, 6 DNC Do Not Connect 2 MODE Data Format Select and DCS 2 CLK Clock Input Pin Mode Selection 4 PDWN Power-Down Function Select 3 SENSE Reference Mode Selection 7 to 14, D0 (LSB) to Data Output Bits 4 VREF Voltage Reference Input/Output 17 to 20 D11 (MSB) 5 REFB Differential Reference (–) 15 DGND Digital Output Ground 6 REFT Differential Reference (+) 16 DRVDD Digital Output Driver Supply 7, 12 AVDD Analog Power Supply 21 OTR Out-of-Range Indicator 8, 11 AGND Analog Ground 22 MODE Data Format Select and DCS Mode 9 VIN+ Analog Input Pin (+) Selection 10 VIN– Analog Input Pin (–) 23 SENSE Reference Mode Selection 13 CLK Clock Input Pin 24 VREF Voltage Reference Input/Output 14 PDWN Power-Down Function Select 25 REFB Differential Reference (–) 15 to 22, D0 (LSB) to Data Output Bits 26 REFT Differential Reference (+) 25 to 28 D11 (MSB) 27, 32 AVDD Analog Power Supply 23 DGND Digital Output Ground 28, 31 AGND Analog Ground 24 DRVDD Digital Output Driver Supply 29 VIN+ Analog Input Pin (+) 30 VIN– Analog Input Pin (–) EP Exposed Pad. It is recommended that the exposed paddle be soldered to the ground plane for the LFCSP. There is an increased reliability of the solder joints, and the maximum thermal capability of the package is achieved with the exposed paddle soldered to the customer board. Rev. C | Page 9 of 36 Document Outline Features Applications General Description Functional Block Diagram Product Highlights Revision History DC Specifications AC Specifications Digital Specifications Switching Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Terminology Pin Configurations and Function Descriptions Equivalent Circuits Typical Performance Characteristics Theory of Operation Analog Input and Reference Overview Differential Input Configurations Single-Ended Input Configuration Clock Input Considerations Jitter Considerations Power Dissipation and Standby Mode Digital Outputs Timing Voltage Reference Internal Reference Connection External Reference Operation Operational Mode Selection Evaluation Board TSSOP Evaluation Board LFCSP Evaluation Board Outline Dimensions Ordering Guide