Datasheet AD7714 (Analog Devices) - 9
| Manufacturer | Analog Devices |
| Description | CMOS, 3V/5V, 500 µA, 24-Bit Sigma-Delta, Signal Conditioning ADC |
| Pages / Page | 41 / 9 — AD7714. ABSOLUTE MAXIMUM RATINGS*. CAUTION. WARNING!. ESD SENSITIVE … |
| Revision | C |
| File Format / Size | PDF / 352 Kb |
| Document Language | English |
AD7714. ABSOLUTE MAXIMUM RATINGS*. CAUTION. WARNING!. ESD SENSITIVE DEVICE. PIN CONFIGURATIONS. DIP and SOIC/TSSOP. SSOP. SCLK. DGND
Model Line for this Datasheet
- AD7714ACHIPS-3 AD7714ACHIPS-5 AD7714AN-5 AD7714ANZ-5 AD7714AR-5 AD7714AR-5REEL AD7714ARS-5 AD7714ARSZ-3 AD7714ARSZ-3REEL AD7714ARSZ-5 AD7714ARSZ-5REEL AD7714ARZ-3 AD7714ARZ-3REEL AD7714ARZ-5 AD7714ARZ-5REEL AD7714YNZ AD7714YR AD7714YRU AD7714YRUZ AD7714YRUZ-REEL AD7714YRUZ-REEL7 AD7714YRZ AD7714YRZ-REEL AD7714YRZ-REEL7
Text Version of Document
AD7714 ABSOLUTE MAXIMUM RATINGS*
SOIC Package, Power Dissipation . 450 mW (TA = +25°C unless otherwise noted) θJA Thermal Impedance . 75°C/W AVDD to AGND . –0.3 V to +7 V Lead Temperature, Soldering AVDD to DGND . –0.3␣ V to +7␣ V Vapor Phase (60 sec) . +215°C DVDD to AGND . –0.3␣ V to +7␣ V Infrared (15 sec) . +220°C DVDD to DGND . –0.3␣ V to +7␣ V SSOP Package, Power Dissipation . 450 mW Analog Input Voltage to AGND . –0.3 V to AVDD + 0.3␣ V θJA Thermal Impedance . 109°C/W Reference Input Voltage to AGND . –0.3 V to AVDD + 0.3␣ V Lead Temperature, Soldering Digital Input Voltage to DGND . –0.3 V to DVDD + 0.3 V Vapor Phase (60 sec) . +215°C Digital Output Voltage to DGND . –0.3 V to DVDD + 0.3 V Infrared (15 sec) . +220°C Operating Temperature Range TSSOP Package, Power Dissipation . 450 mW Commercial (A Version) . –40°C to +85°C θJA Thermal Impedance . 128°C/W Extended (Y Version) . –40°C to +105°C Lead Temperature, Soldering Storage Temperature Range . –65°C to +150°C Vapor Phase (60 sec) . +215°C Junction Temperature . +150°C Infrared (15 sec) . +220°C Plastic DIP Package, Power Dissipation . 450 mW θ *Stresses above those listed under Absolute Maximum Ratings may cause perma- JA Thermal Impedance . 105°C/W nent damage to the device. This is a stress rating only; functional operation of the Lead Temperature (Soldering, 10 sec) . +260°C device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although these devices feature proprietary ESD protection circuitry, permanent damage may still occur on these devices if they are subjected to high energy electrostatic discharges. Therefore,
ESD SENSITIVE DEVICE
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATIONS DIP and SOIC/TSSOP SSOP SCLK DGND SCLK DGND MCLK IN DVDD MCLK IN DVDD MCLK OUT DIN MCLK OUT DIN POL DOUT POL DOUT SYNC DRDY SYNC DRDY RESET CS AD7714 AD7714 RESET CS NC NC TOP VIEW TOP VIEW AIN1 AGND (Not to Scale) NC (Not to Scale) NC AIN2 AIN6 AIN1 AGND AIN3 AIN5 AIN2 AIN6 AIN4 REF IN(+) AIN3 AIN5 STANDBY REF IN(–) AIN4 REF IN(+) AVDD BUFFER STANDBY REF IN(–) AVDD BUFFER NC = NO CONNECT
–8– REV. C
SOIC Package, Power Dissipation . 450 mW (TA = +25°C unless otherwise noted) θJA Thermal Impedance . 75°C/W AVDD to AGND . –0.3 V to +7 V Lead Temperature, Soldering AVDD to DGND . –0.3␣ V to +7␣ V Vapor Phase (60 sec) . +215°C DVDD to AGND . –0.3␣ V to +7␣ V Infrared (15 sec) . +220°C DVDD to DGND . –0.3␣ V to +7␣ V SSOP Package, Power Dissipation . 450 mW Analog Input Voltage to AGND . –0.3 V to AVDD + 0.3␣ V θJA Thermal Impedance . 109°C/W Reference Input Voltage to AGND . –0.3 V to AVDD + 0.3␣ V Lead Temperature, Soldering Digital Input Voltage to DGND . –0.3 V to DVDD + 0.3 V Vapor Phase (60 sec) . +215°C Digital Output Voltage to DGND . –0.3 V to DVDD + 0.3 V Infrared (15 sec) . +220°C Operating Temperature Range TSSOP Package, Power Dissipation . 450 mW Commercial (A Version) . –40°C to +85°C θJA Thermal Impedance . 128°C/W Extended (Y Version) . –40°C to +105°C Lead Temperature, Soldering Storage Temperature Range . –65°C to +150°C Vapor Phase (60 sec) . +215°C Junction Temperature . +150°C Infrared (15 sec) . +220°C Plastic DIP Package, Power Dissipation . 450 mW θ *Stresses above those listed under Absolute Maximum Ratings may cause perma- JA Thermal Impedance . 105°C/W nent damage to the device. This is a stress rating only; functional operation of the Lead Temperature (Soldering, 10 sec) . +260°C device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although these devices feature proprietary ESD protection circuitry, permanent damage may still occur on these devices if they are subjected to high energy electrostatic discharges. Therefore,
ESD SENSITIVE DEVICE
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
PIN CONFIGURATIONS DIP and SOIC/TSSOP SSOP SCLK DGND SCLK DGND MCLK IN DVDD MCLK IN DVDD MCLK OUT DIN MCLK OUT DIN POL DOUT POL DOUT SYNC DRDY SYNC DRDY RESET CS AD7714 AD7714 RESET CS NC NC TOP VIEW TOP VIEW AIN1 AGND (Not to Scale) NC (Not to Scale) NC AIN2 AIN6 AIN1 AGND AIN3 AIN5 AIN2 AIN6 AIN4 REF IN(+) AIN3 AIN5 STANDBY REF IN(–) AIN4 REF IN(+) AVDD BUFFER STANDBY REF IN(–) AVDD BUFFER NC = NO CONNECT
–8– REV. C
