Datasheet AD8131 (Analog Devices) - 8
| Manufacturer | Analog Devices |
| Description | Low-Cost, High Speed Differential Driver |
| Pages / Page | 21 / 8 — AD8131. ABSOLUTE MAXIMUM RATINGS. Table 5.1. Parameter Rating. 2.0. TJ = … |
| Revision | B |
| File Format / Size | PDF / 297 Kb |
| Document Language | English |
AD8131. ABSOLUTE MAXIMUM RATINGS. Table 5.1. Parameter Rating. 2.0. TJ = 150. 8-LEAD SOIC. PACKAGE. 1.5. TION. ISSIPA D R. 1.0. 8-LEAD. POW M. MSOP
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link to page 8
AD8131 ABSOLUTE MAXIMUM RATINGS Table 5.1
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress Supply Voltage ±5.5 V rating only, functional operation of the device at these or any VOCM ±VS other conditions above those indicated in the operational Internal Power Dissipation 250 mW section of this specification is not implied. Exposure to absolute Operating Temperature Range −40°C to +125°C maximum rating conditions for extended periods may affect Storage Temperature Range −65°C to +150°C device reliability. Lead Temperature (Soldering 10 sec) 300°C
2.0
1 Thermal resistance measured on SEMI standard 4-layer board. 8-lead SOIC: θ
TJ = 150
°
C
JA = 121°C/W.
)
8-lead MSOP: θ
W
JA = 142°C/W.
( 8-LEAD SOIC PACKAGE 1.5 TION ISSIPA D R 1.0 E 8-LEAD POW M MSOP U PACKAGE XIM 0.5 A M 0
01072-044
–50 –20 10 40 70 100 130 AMBIENT TEMPERATURE (
°
C)
Figure 3. Plot of Maximum Power Dissipation vs. Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. B | Page 7 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION SPECIFICATIONS ±DIN TO ±OUT SPECIFICATIONS VOCM TO ±OUT SPECIFICATIONS ±DIN TO ±OUT SPECIFICATIONS VOCM TO ±OUT SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OPERATIONAL DESCRIPTION THEORY OF OPERATION ANALYZING AN APPLICATION CIRCUIT CLOSED-LOOP GAIN ESTIMATING THE OUTPUT NOISE VOLTAGE CALCULATING THE INPUT IMPEDANCE OF AN APPLICATION CIRCUIT INPUT COMMON-MODE VOLTAGE RANGE IN SINGLE-SUPPLY APPLICATIONS SETTING THE OUTPUT COMMON-MODE VOLTAGE DRIVING A CAPACITIVE LOAD APPLICATIONS TWISTED-PAIR LINE DRIVER 3 V SUPPLY DIFFERENTIAL A-TO-D DRIVER UNITY-GAIN, SINGLE-ENDED-TO-DIFFERENTIAL DRIVER OUTLINE DIMENSIONS ORDERING GUIDE
AD8131 ABSOLUTE MAXIMUM RATINGS Table 5.1
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress Supply Voltage ±5.5 V rating only, functional operation of the device at these or any VOCM ±VS other conditions above those indicated in the operational Internal Power Dissipation 250 mW section of this specification is not implied. Exposure to absolute Operating Temperature Range −40°C to +125°C maximum rating conditions for extended periods may affect Storage Temperature Range −65°C to +150°C device reliability. Lead Temperature (Soldering 10 sec) 300°C
2.0
1 Thermal resistance measured on SEMI standard 4-layer board. 8-lead SOIC: θ
TJ = 150
°
C
JA = 121°C/W.
)
8-lead MSOP: θ
W
JA = 142°C/W.
( 8-LEAD SOIC PACKAGE 1.5 TION ISSIPA D R 1.0 E 8-LEAD POW M MSOP U PACKAGE XIM 0.5 A M 0
01072-044
–50 –20 10 40 70 100 130 AMBIENT TEMPERATURE (
°
C)
Figure 3. Plot of Maximum Power Dissipation vs. Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. B | Page 7 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION SPECIFICATIONS ±DIN TO ±OUT SPECIFICATIONS VOCM TO ±OUT SPECIFICATIONS ±DIN TO ±OUT SPECIFICATIONS VOCM TO ±OUT SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OPERATIONAL DESCRIPTION THEORY OF OPERATION ANALYZING AN APPLICATION CIRCUIT CLOSED-LOOP GAIN ESTIMATING THE OUTPUT NOISE VOLTAGE CALCULATING THE INPUT IMPEDANCE OF AN APPLICATION CIRCUIT INPUT COMMON-MODE VOLTAGE RANGE IN SINGLE-SUPPLY APPLICATIONS SETTING THE OUTPUT COMMON-MODE VOLTAGE DRIVING A CAPACITIVE LOAD APPLICATIONS TWISTED-PAIR LINE DRIVER 3 V SUPPLY DIFFERENTIAL A-TO-D DRIVER UNITY-GAIN, SINGLE-ENDED-TO-DIFFERENTIAL DRIVER OUTLINE DIMENSIONS ORDERING GUIDE
