Datasheet LT3045-1 (Analog Devices) - 33
| Manufacturer | Analog Devices |
| Description | 20V, 500mA, Ultralow Noise, Ultrahigh PSRR Linear Regulator with VIOC Control |
| Pages / Page | 36 / 33 — PACKAGE DESCRIPTION. Please refer to … |
| File Format / Size | PDF / 3.3 Mb |
| Document Language | English |
PACKAGE DESCRIPTION. Please refer to http://www.linear.com/product/LT3045-1#packaging. for the most recent package drawings
Model Line for this Datasheet
Text Version of Document
LT3045-1
PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LT3045-1#packaging for the most recent package drawings. DD Package 12-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1725 Rev A) 0.70 ±0.05 3.50 ±0.05 2.38 ±0.05 2.10 ±0.05 1.65 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.45 BSC 2.25 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.115 0.40 ±0.10 TYP 7 12 2.38 ±0.10 3.00 ±0.10 (4 SIDES) 1.65 ±0.10 PIN 1 PIN 1 NOTCH TOP MARK R = 0.20 OR (SEE NOTE 6) 0.25 × 45° CHAMFER 6 1 0.200 REF 0.75 ±0.05 0.23 ±0.05 0.45 BSC 2.25 REF (DD12) DFN 0106 REV A 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 30451fa For more information www.linear.com/LT3045-1 33 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
PACKAGE DESCRIPTION Please refer to http://www.linear.com/product/LT3045-1#packaging for the most recent package drawings. DD Package 12-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1725 Rev A) 0.70 ±0.05 3.50 ±0.05 2.38 ±0.05 2.10 ±0.05 1.65 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.45 BSC 2.25 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.115 0.40 ±0.10 TYP 7 12 2.38 ±0.10 3.00 ±0.10 (4 SIDES) 1.65 ±0.10 PIN 1 PIN 1 NOTCH TOP MARK R = 0.20 OR (SEE NOTE 6) 0.25 × 45° CHAMFER 6 1 0.200 REF 0.75 ±0.05 0.23 ±0.05 0.45 BSC 2.25 REF (DD12) DFN 0106 REV A 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 30451fa For more information www.linear.com/LT3045-1 33 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Applications Information Typical Applications Package Description Revision History Typical Application Related Parts
