Datasheet MCP6V91, MCP6V91U, MCP6V92, MCP6V94 (Microchip) - 5

link to page 6 link to page 6 link to page 5 link to page 5 link to page 5 link to page 6 link to page 14 link to page 14 link to page 20 link to page 5
MCP6V91/1U/2/4 TABLE 1-2: AC ELECTRICAL SPECIFICATIONS Electrical Characteristics:
Unless otherwise indicated, TA = +25°C, VDD = +2.4V to +5.5V, VSS = GND, VCM = VDD/3, VOUT = VDD/2, VL = VDD/2, RL = 10 kΩ to VL and CL = 30 pF (refer to Figures 1-4 and 1-5).
Parameters Sym. Min. Typ. Max. Units Conditions Amplifier AC Response
Gain Bandwidth Product GBWP — 10 — MHz Slew Rate SR — 9.5 — V/µs Phase Margin PM — 60 — °C G = +1
Amplifier Noise Response
Input Noise Voltage Eni — 0.08 — µVP-P f = 0.01 Hz to 1 Hz Eni — 0.24 — µVP-P f = 0.1 Hz to 10 Hz Input Noise Voltage Density eni — 11 — nV/√Hz f < 2 kHz, VDD = 5.5V Input Noise Current Density ini — 6 — fA/√Hz
Amplifier Distortion(1 )
Intermodulation Distortion (AC) IMD — 35 — µVPK VCM tone = 100 mVPK at 1 kHz, GN = 11, RTI
Amplifier Step Response
Start-Up Time tSTR — 100 — µs G = +1, 0.1% VOUT settling
(Note 2 )
Offset Correction Settling Time tSTL — 60 — µs G = +1, VIN step of 2V, VOS within 100 µV of its final value Output Overdrive Recovery Time tODR — 65 — µs G = -10, ±0.5V input overdrive to VDD/2, VIN 50% point to VOUT 90% point
(Note 3) EMI Protection
EMI Rejection Ratio EMIRR — 88 — dB VIN = 0.1 VPK, f = 400 MHz — 95 — VIN = 0.1 VPK, f = 900 MHz — 93 — VIN = 0.1 VPK, f = 1800 MHz — 90 — VIN = 0.1 VPK, f = 2400 MHz
Note 1:
These parameters were characterized using the circuit in Figure 1-6. In Figures 2-40 and 2-41, there is an IMD tone at DC, a residual tone at 1 kHz and other IMD tones and clock tones. IMD is Referred to Input (RTI).
2:
High gains behave differently; see
Section 4.3.3 “Offset at Power-Up”
.
3:
tSTL and tODR include some uncertainty due to clock edge timing.
TABLE 1-3: TEMPERATURE SPECIFICATIONS Electrical Characteristics:
Unless otherwise indicated, all limits are specified for: VDD = +2.4V to +5.5V, VSS = GND.
Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges
Specified Temperature Range TA -40 — +125 °C Operating Temperature Range TA -40 — +125 °C
Note 1
Storage Temperature Range TA -65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 5LD-SC70 JA — 209 — °C/W Thermal Resistance, 5LD-SOT-23 JA — 201 — °C/W Thermal Resistance, 8L-2x3 TDFN JA — 53 — °C/W Thermal Resistance, 8L-MSOP JA — 211 — °C/W Thermal Resistance, 14L-TSSOP JA — 100 — °C/W
Note 1:
Operation must not cause TJ to exceed Maximum Junction Temperature specification (+150°C).  2015-2016 Microchip Technology Inc. DS20005434B-page 5 Document Outline 10 MHz, Zero-Drift Op Amps Features Typical Applications Design Aids Related Parts General Description Package Types Typical Application Circuit 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings 1.2 Specifications TABLE 1-1: DC Electrical Specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Timing Diagrams FIGURE 1-1: Amplifier Start-Up. FIGURE 1-2: Offset Correction Settling Time. FIGURE 1-3: Output Overdrive Recovery. 1.4 Test Circuits FIGURE 1-4: AC and DC Test Circuit for Most Noninverting Gain Conditions. FIGURE 1-5: AC and DC Test Circuit for Most Inverting Gain Conditions. FIGURE 1-6: Test Circuit for Dynamic Input Behavior. 2.0 Typical Performance Curves 2.1 DC Input Precision FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage Quadratic Temperature Coefficient. FIGURE 2-4: Input Offset Voltage vs. Power Supply Voltage with VCM = VCML. FIGURE 2-5: Input Offset Voltage vs. Power Supply Voltage with VCM = VCMH. FIGURE 2-6: Input Offset Voltage vs. Output Voltage with VDD = 2.4V. FIGURE 2-7: Input Offset Voltage vs. Output Voltage with VDD = 5.5V. FIGURE 2-8: Input Offset Voltage vs. Common-Mode Voltage with VDD = 2.4V. FIGURE 2-9: Input Offset Voltage vs. Common-Mode Voltage with VDD = 5.5V. FIGURE 2-10: Common-Mode Rejection Ratio. FIGURE 2-11: Power Supply Rejection Ratio. FIGURE 2-12: DC Open-Loop Gain. FIGURE 2-13: CMRR and PSRR vs. Ambient Temperature. FIGURE 2-14: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-15: Input Bias and Offset Currents vs. Common-Mode Input Voltage with TA = +85°C. FIGURE 2-16: Input Bias and Offset Currents vs. Common-Mode Input Voltage with TA = +125°C. FIGURE 2-17: Input Bias and Offset Currents vs. Ambient Temperature with VDD = 5.5V. FIGURE 2-18: Input Bias Current vs. Input Voltage (Below VSS). 2.2 Other DC Voltages and Currents FIGURE 2-19: Input Common-Mode Voltage Headroom (Range) vs. Ambient Temperature. FIGURE 2-20: Output Voltage Headroom vs. Output Current. FIGURE 2-21: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-22: Output Short-Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Supply Current vs. Power Supply Voltage. FIGURE 2-24: Power-On Reset Trip Voltage. FIGURE 2-25: Power-On Reset Voltage vs. Ambient Temperature. 2.3 Frequency Response FIGURE 2-26: CMRR and PSRR vs. Frequency. FIGURE 2-27: Open-Loop Gain vs. Frequency with VDD = 2.4V. FIGURE 2-28: Open-Loop Gain vs. Frequency with VDD = 5.5V. FIGURE 2-29: Gain Bandwidth Product and Phase Margin vs. Ambient Temperature. FIGURE 2-30: Gain Bandwidth Product and Phase Margin vs. Common-Mode Input Voltage. FIGURE 2-31: Gain Bandwidth Product and Phase Margin vs. Output Voltage. FIGURE 2-32: Closed-Loop Output Impedance vs. Frequency with VDD = 2.2V. FIGURE 2-33: Closed-Loop Output Impedance vs. Frequency with VDD = 5.5V. FIGURE 2-34: Maximum Output Voltage Swing vs. Frequency. FIGURE 2-35: EMIRR vs. Frequency. FIGURE 2-36: EMIRR vs. Input Voltage. FIGURE 2-37: Channel-to Channel Separation vs. Frequency. 2.4 Input Noise and Distortion FIGURE 2-38: Input Noise Voltage Density and Integrated Input Noise Voltage vs. Frequency. FIGURE 2-39: Input Noise Voltage Density vs. Input Common-Mode Voltage. FIGURE 2-40: Intermodulation Distortion vs. Frequency with VCM Disturbance (see Figure 1-6). FIGURE 2-41: Intermodulation Distortion vs. Frequency with VDD Disturbance (see Figure 1-6). FIGURE 2-42: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD = 2.4V. FIGURE 2-43: Input Noise vs. Time with 1 Hz and 10 Hz Filters and VDD = 5.5V. 2.5 Time Response FIGURE 2-44: Input Offset Voltage vs. Time with Temperature Change. FIGURE 2-45: Input Offset Voltage vs. Time at Power-Up. FIGURE 2-46: The MCP6V91/1U/2/4 Family Shows No Input Phase Reversal with Overdrive. FIGURE 2-47: Noninverting Small Signal Step Response. FIGURE 2-48: Noninverting Large Signal Step Response. FIGURE 2-49: Inverting Small Signal Step Response. FIGURE 2-50: Inverting Large Signal Step Response. FIGURE 2-51: Slew Rate vs. Ambient Temperature. FIGURE 2-52: Output Overdrive Recovery vs. Time with G = -10 V/V. FIGURE 2-53: Output Overdrive Recovery Time vs. Inverting Gain. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs (VOUT, VOUTA, VOUTB, VOUTC, VOUTD) 3.2 Analog Inputs (VIN+, VIN-, VINB+, VINB-, VINC-, VINC+, VIND-, VIND+) 3.3 Power Supply Pins (VDD, VSS) 3.4 Exposed Thermal Pad (EP) 4.0 Applications 4.1 Overview of Zero-Drift Operation FIGURE 4-1: Simplified Zero-Drift Op Amp Functional Diagram. FIGURE 4-2: First Chopping Clock Phase; Equivalent Amplifier Diagram. FIGURE 4-3: Second Chopping Clock Phase; Equivalent Amplifier Diagram. 4.2 Other Functional Blocks FIGURE 4-4: Simplified Analog Input ESD Structures. FIGURE 4-5: Protecting the Analog Inputs Against High Voltages. FIGURE 4-6: Protecting the Analog Inputs Against High Currents. 4.3 Application Tips FIGURE 4-7: Output Resistor, RISO, Stabilizes Capacitive Loads. FIGURE 4-8: Recommended RISO Values for Capacitive Loads. FIGURE 4-9: Output Load. FIGURE 4-10: Amplifier with Parasitic Capacitance. 4.4 Typical Applications FIGURE 4-11: Simple Design. FIGURE 4-12: RTD Sensor. FIGURE 4-13: Offset Correction. FIGURE 4-14: Precision Comparator. 5.0 Design Aids 5.1 FilterLab® Software 5.2 Microchip Advanced Part Selector (MAPS) 5.3 Analog Demonstration and Evaluation Boards 5.4 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Revision B (March 2016) Revision A (September 2015) Product Identification System Trademarks Worldwide Sales and Service