Datasheet DN2625 (Microchip) - 8
| Manufacturer | Microchip |
| Description | N-Channel Depletion-Mode Vertical DMOS FET in Single and Dual Options |
| Pages / Page | 14 / 8 — DN2625. 5.0. PACKAGING INFORMATION. 5.1. Package Marking Information. … |
| File Format / Size | PDF / 998 Kb |
| Document Language | English |
DN2625. 5.0. PACKAGING INFORMATION. 5.1. Package Marking Information. Legend:. Note
Model Line for this Datasheet
Text Version of Document
DN2625 5.0 PACKAGING INFORMATION 5.1 Package Marking Information
TO-252 (D-PAK) Example 8-lead DFN Example XXXXXXX DN2625D XXXX DN XXXXXXX K6 XXXXX e3 2625 e3 e3 YYWW e3 1613 YYWWNNN 1641343 NNN 343
Legend:
XX...X Product Code or Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC® designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator ( ) e3 can be found on the outer packaging for this package.
Note
: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo. DS20005537B-page 8 2017 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics Absolute Maximum Ratings† Temperature Specifications Thermal characteristics 2.0 Typical Performance Curves FIGURE 2-1: Output Characteristics. FIGURE 2-2: Transfer Characteristics. FIGURE 2-3: Saturation Characteristics. FIGURE 2-4: BVDSX Variation with Temperature. FIGURE 2-5: On-resistance vs. Drain Current. FIGURE 2-6: VGS(OFF) and RDS(ON) Variation with Temperature. FIGURE 2-7: Transconductance vs. Drain Current. 3.0 Pin Description TABLE 3-1: TO-252 D-PAK Pin Function Table TABLE 3-2: 8-lead DFN (dual Pad) Pin Function Table 4.0 Functional Description FIGURE 4-1: Switching Waveforms and Test Circuit. Product Summary 5.0 Packaging Information 5.1 Package Marking Information
TO-252 (D-PAK) Example 8-lead DFN Example XXXXXXX DN2625D XXXX DN XXXXXXX K6 XXXXX e3 2625 e3 e3 YYWW e3 1613 YYWWNNN 1641343 NNN 343
Legend:
XX...X Product Code or Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC® designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator ( ) e3 can be found on the outer packaging for this package.
Note
: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo. DS20005537B-page 8 2017 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics Absolute Maximum Ratings† Temperature Specifications Thermal characteristics 2.0 Typical Performance Curves FIGURE 2-1: Output Characteristics. FIGURE 2-2: Transfer Characteristics. FIGURE 2-3: Saturation Characteristics. FIGURE 2-4: BVDSX Variation with Temperature. FIGURE 2-5: On-resistance vs. Drain Current. FIGURE 2-6: VGS(OFF) and RDS(ON) Variation with Temperature. FIGURE 2-7: Transconductance vs. Drain Current. 3.0 Pin Description TABLE 3-1: TO-252 D-PAK Pin Function Table TABLE 3-2: 8-lead DFN (dual Pad) Pin Function Table 4.0 Functional Description FIGURE 4-1: Switching Waveforms and Test Circuit. Product Summary 5.0 Packaging Information 5.1 Package Marking Information
