Datasheet MCP1700 (Microchip) - 10

MCP1700
3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin No.
SOT-23 Pin No.
SOT-89 Pin No.
TO-92 Pin No.
2x2 DFN-6 1 1 1 3 GND Ground Terminal 2 3 3 6 VOUT Regulated Voltage Output 3.1 Function 3 2 2 1 VIN Unregulated Supply Voltage — — — 2, 4, 5 NC No Connect — — — 7 EP Exposed Thermal Pad Ground Terminal (GND) Regulator ground. Tie GND to the negative side of the
output and the negative side of the input capacitor.
Only the LDO bias current (1.6 µA typical) flows out of
this pin; there is no high current. The LDO output
regulation is referenced to this pin. Minimize voltage
drops between this pin and the negative side of the
load. 3.2 Name Regulated Output Voltage (VOUT) 3.4 No Connect (NC) No internal connection. The pins marked NC are true
“No Connect” pins. 3.5 Exposed Thermal Pad (EP) There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the GND pin; they
must be connected to the same potential on the Printed
Circuit Board (PCB). Connect VOUT to the positive side of the load and the
positive terminal of the output capacitor. The positive
side of the output capacitor should be physically
located as close to the LDO VOUT pin as is practical.
The current flowing out of this pin is equal to the DC
load current. 3.3 Unregulated Input Voltage Pin
(VIN) Connect VIN to the input unregulated source voltage.
As with all low dropout linear regulators, low source
impedance is necessary for the stable operation of the
LDO. The amount of capacitance required to ensure
low source impedance will depend on the proximity of
the input source capacitors or battery type. For most
applications, 1 µF of capacitance will ensure stable
operation of the LDO circuit. For applications that have
load currents below 100 mA, the input capacitance
requirement can be lowered. The type of capacitor
used can be ceramic, tantalum or aluminum
electrolytic. The low ESR characteristics of the ceramic
will yield better noise and PSRR performance at high
frequency. DS20001826D-page 10  2005-2016 Microchip Technology Inc.