Datasheet ISL32704E (Intersil) - 5

link to page 5 link to page 5 link to page 5 link to page 5 link to page 5 link to page 5 link to page 5 link to page 5 link to page 7 link to page 7 ISL32704E Electrical Specifications Test Conditions: TMIN to TMAX, VDD1 = VDD2 = 4.5V to 5.5V; unless otherwise stated (see (Note 6). (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNIT Receiver Input Hysteresis VHYS VCM = 0V 70 mV Differential Bus Input Capacitance CD 9 12 pF Receiver Output High Voltage VOH IO = -20µA, VID = -50mV VDD1 - 0.2 VDD1 V Receiver Output Low Voltage VOL IO = +20µA, VID = -200mV 0.2 V High impedance Output Current IOZ 0.4V ≤ VO ≤ (VDD2 - 0.5) -1 1 µA Receiver Input Resistance RIN -7V ≤ VCM ≤ 12V 12 kΩ Supply Current IDD2 DE = VDD1, no load 5 16 mA ESD PERFORMANCE RS-485 Bus Pins (A, B) Human body model discharge to GND2 ±15 kV All Pins (R, RE, D, DE) Human body model discharge to GND1 ±2 kV SWITCHING CHARACTERISTICS VDD1 = 5V, VDD2 = 5V Data Rate DR RL = 54Ω, CL = 50pF 4 Mbps Propagation Delay (Notes 7, 14) tPD VO = -1.5V to 1.5V, CL = 15pF 48 150 ns Pulse Skew (Notes 7, 15) tSK (P) VO = -1.5V to 1.5V, CL = 15pF 6 15 ns Output Enable Time to High Level tPZH CL = 15pF 33 50 ns Output Enable Time to Low Level tPZL CL = 15pF 33 50 ns Output Disable Time from High Level tPHZ CL = 15pF 33 50 ns Output Disable Time from Low Level tPLZ CL = 15pF 33 50 ns Common-Mode Transient Immunity CMTI VCM = 1500 VDC, tTRANSIENT = 25ns 30 50 kV/µs VDD1 = 3.3V, VDD2 = 5V Data Rate DR RL = 54Ω, CL = 50pF 4 Mbps Propagation Delay (Notes 8, 14) tPD VO = -1.5V to 1.5V, CL = 15pF 48 150 ns Pulse Skew (Notes 8, 15) tSK (P) VO = -1.5V to 1.5V, CL = 15pF 6 20 ns Output Enable Time to High Level tPZH CL = 15pF 33 50 ns Output Enable Time to Low Level tPZL CL = 15pF 33 50 ns Output Disable Time from High Level tPHZ CL = 15pF 33 50 ns Output Disable Time from Low Level tPLZ CL = 15pF 33 50 ns Common-Mode Transient Immunity CMTI VCM = 1500 VDC, tTRANSIENT = 25ns 30 50 kV/µs NOTES: (applies to both driver and receiver sections) 6. All voltages on the isolator primary side are with respect to GND1. All line voltages and common-mode voltages on the isolator secondary or bus side are with respect to GND2. 7. Differential I/O voltage is measured at the noninverting bus terminal A with respect to the inverting terminal B. 8. Skew limit is the maximum propagation delay difference between any two devices at +25°C. 9. The power-off measurement in ANSI Standard EIA/TIA-422-B applies to disabled outputs only and is not applied to combined inputs and outputs. 10. All typical values are at VDD1, VDD2 = 5V or VDD1 = 3.3V and TA = +25°C. 11. -7V < VCM < 12V; 4.5 < VDD < 5.5V. 12. VOD and VOC are the changes in magnitude of VOD and VOC respectively, that occur when the input is changed from one logic state to the other. 13. This applies for both power-on and power-off; refer to ANSI standard RS-485 for exact condition. The EIA/TIA-422 -B limit does not apply for a combined driver and receiver terminal. 14. Includes 10ns read enable time. Maximum propagation delay is 25ns after read assertion. 15. Pulse skew is defined as |tPLH - tPHL| of each channel. 16. The relevant test and measurement methods are given in the “Electromagnetic Compatibility” on page 7. 17. External magnetic field immunity is improved by this factor if the field direction is “end-to-end” rather than “pin-to-pin” (see diagram in “Electromagnetic Compatibility” on page 7). FN8860 Rev.3.00 Page 5 of 13 Mar 29, 2017 Document Outline Related Literature Features Applications Ordering Information Pin Configurations Truth Table Truth Table Pin Descriptions Typical Operating Circuits Absolute Maximum Ratings (Note 16) Thermal Information Recommended Operating Conditions Electrical Specifications Insulation Specifications Magnetic Field Immunity (Note 16) Safety and Approvals VDE V 0884-11 (Certification Pending) UL 1577 Electromagnetic Compatibility Application Information RS-485 and Isolation Digital Isolator Principle GMR Resistor in Detail Low Emissions Low EMI Susceptibility Receiver (Rx) Features Driver (Tx) Features Built-In Driver Overload Protection Dynamic Power Consumption Power Supply Decoupling DC Correctness Data Rate, Cables, and Terminations Transient Protection Pinout Differences Between Packages Revision History About Intersil Package Outline Drawing M16.15B M16.3A