Datasheet TC4431, TC4432 (Microchip) - 8
| Manufacturer | Microchip |
| Description | 1.5A High-Speed 30V MOSFET Drivers |
| Pages / Page | 18 / 8 — TC4431/TC4432. 5.0. PACKAGING INFORMATION. 5.1. Package Marking … |
| Revision | 01-11-2008 |
| File Format / Size | PDF / 279 Kb |
| Document Language | English |
TC4431/TC4432. 5.0. PACKAGING INFORMATION. 5.1. Package Marking Information. TC4432. TC4431. Legend:. Note
Model Line for this Datasheet
Text Version of Document
TC4431/TC4432 5.0 PACKAGING INFORMATION 5.1 Package Marking Information
8-Lead CERDIP (300 mil) Example: XXXXXXXX
TC4432
XXXXXNNN EJA^^256 e3 YYWW 0749 8-Lead PDIP (300 mil) Example: XXXXXXXX
TC4431
XXXXXNNN EPA^^256 e3 YYWW 0749 8-Lead SOIC (150 mil) Example: XXXXXXXX
TC4431
E XXXXYYWW OA^^0749 e3 NNN 256
Legend:
XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator ( ) e3 can be found on the outer packaging for this package.
Note
: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS21424D-page 8 © 2007 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Supply Current vs. Capacitive Load. FIGURE 2-2: Input Current vs. Input Voltage. FIGURE 2-3: Rise/Fall Time vs. VDD. FIGURE 2-4: tD1 and tD2 Delay vs. VDD. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Supply Input (VDD) 3.2 Control Input (IN) 3.3 Lockout Disable (LOCK DIS) 3.4 Ground (GND) 3.5 Drive Output (OUT) 4.0 Applications Information FIGURE 4-1: Switching Time Test Circuit. 5.0 Packaging Information 5.1 Package Marking Information
8-Lead CERDIP (300 mil) Example: XXXXXXXX
TC4432
XXXXXNNN EJA^^256 e3 YYWW 0749 8-Lead PDIP (300 mil) Example: XXXXXXXX
TC4431
XXXXXNNN EPA^^256 e3 YYWW 0749 8-Lead SOIC (150 mil) Example: XXXXXXXX
TC4431
E XXXXYYWW OA^^0749 e3 NNN 256
Legend:
XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code e3 Pb-free JEDEC designator for Matte Tin (Sn)
*
This package is Pb-free. The Pb-free JEDEC designator ( ) e3 can be found on the outer packaging for this package.
Note
: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS21424D-page 8 © 2007 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Supply Current vs. Capacitive Load. FIGURE 2-2: Input Current vs. Input Voltage. FIGURE 2-3: Rise/Fall Time vs. VDD. FIGURE 2-4: tD1 and tD2 Delay vs. VDD. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Supply Input (VDD) 3.2 Control Input (IN) 3.3 Lockout Disable (LOCK DIS) 3.4 Ground (GND) 3.5 Drive Output (OUT) 4.0 Applications Information FIGURE 4-1: Switching Time Test Circuit. 5.0 Packaging Information 5.1 Package Marking Information
