Datasheet MCP9902, MCP9903, MCP9904 (Microchip) - 8

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MCP9902/3/4 3.0 PIN DESCRIPTIONS
The MCP9902/3/4 has two variants that include features unique to each device. Refer to the table to determine applicability of the pin descriptions. The description of the pins is listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE MCP9902 MCP9903 MCP9904 Pin Pin Description WDFN VDFN VDFN Name Type
1 1 1 VDD P Power 2 2 2 DP1 Analog Diode 1/2 Connection 3 3 3 DN1 Analog Diode 1/2 Connection — 4 4 DP2
(1)
(/DN3)
(2)
Analog Diode 1/2 Connection — 5 5 DN2
(1)
(/DP3)
(2)
Analog Diode 1/2 Connection 5 6 6 GND P Ground 4 7 7 THERM/ADDR OD Non-Maskable THERM 6 8 8 ALERT/THERM2 OD Maskable ALERT/THERM2 7 9 9 SMDATA OD SMBus Clock 8 10 10 SMCLK OD SMBus Data 9 11 11 EP — Exposed Thermal pad
Note 1:
MCP9903 only.
2:
MCP9904 only.
3:
See
Section 3.10 “Exposed Thermal Pad (EP)”
for grounding recommendations.
3.1 Power Supply (VDD) 3.6 Ground (GND)
This pin is used to supply power to the device. This pin is used for system ground for the device.
3.2 Diode 1 Pair (DN1/DP1) 3.7 Maskable ALERT
Remote Diode 1 anode (DP1) and cathode (DN1) pins
(ALERT/THERM2)
for the MCP9902/3/4. This pin asserts when a diode temperature exceeds the ALERT threshold. This pin may be masked by
3.3 Diode 2 Pair (DN2/DP2)
register settings. Remote Diode 2 anode (DP2) and cathode (DN2) pins
3.8 SMBus Data (SMDATA)
for the MCP9903. This is the open drain, bidirectional data pin for SMBus
3.4 Anti-Parallel Diode Pair (DN3/DP2
communication.
and DN2/DP3) (MCP9904 only) 3.9 SMBus Clock (SMCLK)
• DP2/DN3: DP2 anode and DN3 cathode This is the SMBus input clock pin for SMBus • DN2/DP3: DN2 cathode and DP3 anode communication.
3.5 THERM LIMIT ALERT 3.10 Exposed Thermal Pad (EP) (THERM/ADDR)
Not internally connected, but recommend grounding for This pin asserts low when the hardware-set THERM mechanical support. limit threshold is exceeded by one of the temperature sensors. The assertion of this signal can’t be controlled or masked by register setting. If enabled, the SMBus slave address is set by the pull-up resistor on this pin. DS20005382C-page 8  2015-2016 Microchip Technology Inc. Document Outline Multi-Channel Low-Temperature Remote Diode Sensor Features Typical Applications Description Package Types MCP9902/3/4 Functional Block Diagram 1.0 Electrical Characteristics 1.1 Electrical Specifications Absolute Maximum Ratings 1.2 DC Characteristics 1.3 Thermal Specifications FIGURE 1-1: POR and POR Rearm With Slow Rising VDD. 1.4 SMBUS Module Specifications FIGURE 1-2: SMBus Timing Diagram. 2.0 Typical Operating Curves FIGURE 2-1: Supply Current vs. Conversion Rate (TA = +25°C, VDD = 3.3V). FIGURE 2-2: IDD vs. Temperature. FIGURE 2-3: Temperature Error vs. Filter Capacitor (VDD = 3.3V, TA = TD = +25°C, 2N3904). FIGURE 2-4: Temperature Error vs. Ambient Temperature (VDD = 3.3V, TD = +25°C, 16 Units, 2N3904). FIGURE 2-5: Temperature Error vs. Remote Temperature. (VDD = 3.3V, TD = +25°C, 16 Units, 2N3904). FIGURE 2-6: Temperature Error vs. Series Resistance (TA = +25°C, VDD = 3.3V). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Power Supply (VDD) 3.2 Diode 1 Pair (DN1/DP1) 3.3 Diode 2 Pair (DN2/DP2) 3.4 Anti-Parallel Diode Pair (DN3/DP2 and DN2/DP3) (MCP9904 only) 3.5 THERM LIMIT ALERT (THERM/ADDR) 3.6 Ground (GND) 3.7 Maskable ALERT (ALERT/THERM2) 3.8 SMBus Data (SMDATA) 3.9 SMBus Clock (SMCLK) 3.10 Exposed Thermal Pad (EP) 4.0 Functional Description FIGURE 4-1: MCP9902/3/4 System Diagram. 4.1 Power States 4.2 Conversion Rates TABLE 4-1: Conversion Rate 4.3 Dynamic Averaging 4.4 THERM Output 4.5 THERM Pin Address Decoding TABLE 4-2: I2C/SMBus Address Decode 4.6 ALERT/THERM2 Output 4.7 Temperature Measurement 4.8 Beta Compensation 4.9 Resistance Error Correction (REC) 4.10 Programmable External Diode Ideality Factor TABLE 4-3: Ideality Factor Look-Up Table (Diode Model) TABLE 4-4: Substrate Diode Ideality Factor Look-Up Table (BJT Model) 4.11 Diode Faults 4.12 Consecutive Alerts TABLE 4-5: Consecutive Alert/ THERM Settings 4.13 Limit Register Interaction 4.14 Digital Filter TABLE 4-6: Filter Settings FIGURE 4-2: Temperature Filter Step Response. FIGURE 4-3: Temperature Filter Impulse Response. 4.15 Temperature Measurement Results and Data TABLE 4-7: Temperature Data Format 5.0 Communications Protocol 5.1 SMBus Control Bits 5.2 SMBus Timeout 5.3 SMBus and I2C Compatibility 5.4 SMBus Protocols TABLE 5-1: Protocol Format TABLE 5-2: Write Byte Protocol TABLE 5-3: Read Byte Protocol TABLE 5-4: Send Byte Protocol TABLE 5-5: Receive Byte Protocol 5.5 Alert Response Address TABLE 5-6: Alert Response Address Protocol 5.6 Register Description TABLE 5-7: Register Set in Hexadecimal Order (Continued) 5.7 Data Read Interlock Register 5-1: iNT TEMP HI BYTE: Internal Diode High Byte Temperature Data Register (ADDRESS 00h) Register 5-2: INT temp LO byte: Internal Diode LOW Byte Temperature Data Register (ADDRESS 29h) Register 5-3: EXT(n) TEMP hi byte: EXTERNAL Diode High Byte Temperature Data Register (Addresses 01h, 23h, 2Ah) Register 5-4: EXT(n) TEMP Lo Byte: EXTERNAL Diode LOW Byte Temperature Data Register (Addresses 10h, 24h, 2Bh) Register 5-5: Status: status register reporting state of internal and external diodes (ADDRESS 02h) Register 5-6: CONFIG: Configuration Register (Addresses 03h and 09h) Register 5-7: CONVERT: TEMPERATURE CONVERSION RATE REGISTER (ADDRESS 04h, 0AH) Register 5-8: int diode hi limit temp: INTERNAL DIODE HIGH LIMIT TEMPERATURE REGISTER (Addresses 05h and 0Bh) Register 5-9: int diode lo lim TEMP – INTERNAL DIODE LOW LIMIT TEMPERATURE REGISTER (addresses 06H AND 0CH) Register 5-10: EXT(n) hi lim temp HB – EXTERNAL DIODE N HIGH TEMPERATURE LIMIT, high byte REGISTER (addresses 07h and 0dh, 15h, 2Ch) Register 5-11: EXT(n) hi lim LB – EXTERNAL DIODE N HIGH LIMIT TEMPERATURE, low byte REGISTER (Addresses 13H, 17h, 2eh) Register 5-12: EXT(n) lo lim HB – EXTERNAL DIODE N low LIMIT, high byte TEMPERATURE REGISTER (addresses 08h and 0eh, 16h, 2Dh) Register 5-13: EXT(N) LO lim LB – EXTERNAL DIODE N LOW LIMIT, low byte TEMPERATURE REGISTER (Addresses 14H, 18h, 2fh) Register 5-14: scrtchpd(N): sCRATCHPAD REGISTER (addresses 11H AND 12H) Register 5-15: ONE SHOT – ONE-shot temperature conversion initiation REGISTER (address 0fh) Register 5-16: EXT(n) THrm lim – external diode (N) therm limit REGISTER (addresses 19h, 1Ah and 30h) Register 5-17: iNTD THrm lim – internal diode therm limit REGISTER (address 20h) Register 5-18: THRM HYS – therm limit hysteresis REGISTER (address 21h) Register 5-19: EXT FLT STS – external diode fault status REGISTER (address 1Bh) Register 5-20: DIODE FAULT MASK – diode fault mask REGISTER (address 1Fh) Register 5-21: CONSEC ALERT – Consecutive Alert Register (address 22h) Register 5-22: ext(N) beta cfg – beta compensation configuration Register (addresses 25h and 26h) Register 5-23: ext (n) IDEALITY FACTOR – External Diode N Ideality Factor Register (addresses 27h, 28h and 31h) Register 5-24: HI LIM STS – High Limit Status Register (address 35h) Register 5-25: LO LIM STS – Low Limit Status Register (address 36h) Register 5-26: THRM LIM STS – High Limit Status Register (address 37h) Register 5-27: FLTR SEL: Filter Selection Register (address 40h) Register 5-28: PROD_ID – Product ID Register (address FDh) Register 5-29: MCHP_ID – Manufacturer ID Register (address FEh) Register 5-30: REVISION – Revision Register (address FFh) 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Revision C (July 2016) Revision B (March 2016) Revision A (December 2015) Product Identification System Trademarks Worldwide Sales and Service