Datasheet AD8065-KGD-CHIP (Analog Devices) - 7
| Manufacturer | Analog Devices |
| Description | High Performance, 145 MHzFastFET Op Amps |
| Pages / Page | 8 / 7 — Known Good Die. AD8065-KGD-CHIP. OUTLINE DIMENSIONS. 1.205. 0.483. 0.885. … |
| File Format / Size | PDF / 182 Kb |
| Document Language | English |
Known Good Die. AD8065-KGD-CHIP. OUTLINE DIMENSIONS. 1.205. 0.483. 0.885. SIDE VIEW. TOP VIEW. (CIRCUIT SIDE). 012. 0.092 × 0.092
Model Line for this Datasheet
Text Version of Document
Known Good Die AD8065-KGD-CHIP OUTLINE DIMENSIONS 1.205 0.483 2 0.885 7 NC 3 6 4 SIDE VIEW -A TOP VIEW (CIRCUIT SIDE) 012 0.092 × 0.092 2 1- 3 8- 0
Figure 2. 6-Pad Bare Die [CHIP] (C-6-5) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Typical Die Specifications Parameter Value Unit
Chip Size 1205 × 855 μm Die Size 47.4 × 33.7 Mil Thickness 483 μm Bond Pads (Min Size) 92 × 92 μm Bond Pad Composition 1% Copper Doped Aluminum % Backside Si Not Applicable Passivation Doped oxide/SiN Not Applicable ESD HBM 1000 V
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Ablestik 84-1LMIS R4 Bonding Method 1 mil gold
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD8065-KGD-CHIP –40°C to +85°C 6-Pad Bare Die [CHIP] C-6-5 Rev. 0 | Page 7 of 8 Document Outline Features Applications General Description Revision History Specifications Absolute Maximum Ratings ESD Caution Pad Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide
Figure 2. 6-Pad Bare Die [CHIP] (C-6-5) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Typical Die Specifications Parameter Value Unit
Chip Size 1205 × 855 μm Die Size 47.4 × 33.7 Mil Thickness 483 μm Bond Pads (Min Size) 92 × 92 μm Bond Pad Composition 1% Copper Doped Aluminum % Backside Si Not Applicable Passivation Doped oxide/SiN Not Applicable ESD HBM 1000 V
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Ablestik 84-1LMIS R4 Bonding Method 1 mil gold
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD8065-KGD-CHIP –40°C to +85°C 6-Pad Bare Die [CHIP] C-6-5 Rev. 0 | Page 7 of 8 Document Outline Features Applications General Description Revision History Specifications Absolute Maximum Ratings ESD Caution Pad Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide
