Datasheet HMC493LP3, 493LP3E (Analog Devices) - 3
| Manufacturer | Analog Devices |
| Description | SMT 6 SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 18 GHz |
| Pages / Page | 6 / 3 — HMC493LP3 / 493LP3E. SMT GaAs HBT MMIC. DIVIDE-BY-4, DC - 18 GHz |
| File Format / Size | PDF / 346 Kb |
| Document Language | English |
HMC493LP3 / 493LP3E. SMT GaAs HBT MMIC. DIVIDE-BY-4, DC - 18 GHz
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Text Version of Document
HMC493LP3 / 493LP3E
v04.0507
SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 18 GHz
6
Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C Absolute Maximum Ratings
500 T RF Input (Vcc = +5V) +13 dBm Supply Voltage (Vcc1, Vcc2) +5.5V 300 Channel Temperature (Tc) 135 °C Continuous Pdiss (T = 85 °C) 593 mW 100 (derate 11.9 mW/° C above 85 °C) S - SM Thermal Resistance (R ) TH 84 °C/W R -100 (junction to ground paddle) O AMPLITUDE (mV) Storage Temperature -65 to +150 °C T -300 Operating Temperature -40 to +85 °C C ESD Sensitivity (HBM) Class 1A E -500 22.7 23.1 23.5 23.9 24.3 24.7 T
Typical Supply Current vs. Vcc
TIME (nS) E Vcc1, Vcc2 (V) Icc (mA) ELECTROSTATIC SENSITIVE DEVICE 4.75 84 & D OBSERVE HANDLING PRECAUTIONS 5.0 96 S 5.25 108 R Note: Divider will operate over full voltage range shown above E
Outline Drawing
ID IV Y D NC E U Q E R F NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] 493 HMC493LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] 493 HMC493LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Information furnish F e o d r pri by An ce, de alog Devic leis vie s rby eli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No
6 - 126
20 Alpha Road, Chelmsford, MA 01824 Phone: 978 Pho - n 25 e: 7 0- 81 3 3 3 2 4 9- 3 F 470 ax: 978 0 • Order o - n 25 lin 0 e a-t 3373 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D
v04.0507
SMT GaAs HBT MMIC DIVIDE-BY-4, DC - 18 GHz
6
Output Voltage Waveform, Pin= 0 dBm, Fout= 882 MHz, T= 25 °C Absolute Maximum Ratings
500 T RF Input (Vcc = +5V) +13 dBm Supply Voltage (Vcc1, Vcc2) +5.5V 300 Channel Temperature (Tc) 135 °C Continuous Pdiss (T = 85 °C) 593 mW 100 (derate 11.9 mW/° C above 85 °C) S - SM Thermal Resistance (R ) TH 84 °C/W R -100 (junction to ground paddle) O AMPLITUDE (mV) Storage Temperature -65 to +150 °C T -300 Operating Temperature -40 to +85 °C C ESD Sensitivity (HBM) Class 1A E -500 22.7 23.1 23.5 23.9 24.3 24.7 T
Typical Supply Current vs. Vcc
TIME (nS) E Vcc1, Vcc2 (V) Icc (mA) ELECTROSTATIC SENSITIVE DEVICE 4.75 84 & D OBSERVE HANDLING PRECAUTIONS 5.0 96 S 5.25 108 R Note: Divider will operate over full voltage range shown above E
Outline Drawing
ID IV Y D NC E U Q E R F NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] 493 HMC493LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] 493 HMC493LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Information furnish F e o d r pri by An ce, de alog Devic leis vie s rby eli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 rights of third parties that may result from its use. Specifications subject to change without notice. No
6 - 126
20 Alpha Road, Chelmsford, MA 01824 Phone: 978 Pho - n 25 e: 7 0- 81 3 3 3 2 4 9- 3 F 470 ax: 978 0 • Order o - n 25 lin 0 e a-t 3373 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D
