Datasheet LT8471 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | Dual Multitopology DC/DC Converters with 2A Switches and Synchronization |
| Pages / Page | 36 / 2 — absoluTe MaxiMuM raTings. (Note 1). pin conFiguraTion |
| File Format / Size | PDF / 488 Kb |
| Document Language | English |
absoluTe MaxiMuM raTings. (Note 1). pin conFiguraTion
Model Line for this Datasheet
Text Version of Document
LT8471
absoluTe MaxiMuM raTings (Note 1)
VIN1, VIN2 Voltages ... –0.3V to 50V SS1, SS2 ... –0.3V to 2.5V C1, C2 Voltages .. –0.4V to 50V FB1, FB2 Voltages ... –2.5V to 2.5V E1, E2 Voltages ... –60V to 50V PG1, PG2 Voltages ... –0.3V to 50V VC1 to VE1 and VC2 to VE2 Voltages .. –0.4V to 60V OV/UV Voltage ... –0.3V to 5V VIN1 to VE1 and VIN2 to VE2 Voltages SHOUT Voltage ... –0.3V to 50V Low Side Configurations (Note 6) .. –0.4V to 40V Operating Junction Temperature Range High Side Configurations (Note 6) ... –0.4V to 60V LT8471E (Notes 2, 5) ... –40°C to 125°C VIN1 to VC1 and VIN2 to VC2 Voltages LT8471I (Notes 2, 5) .. –40°C to 125°C High Side Configurations (Note 6) ... –0.4V to 40V LT8471H (Notes 2, 5) ... –40°C to 150°C C3 Voltage ... –0.4V to 50V Storage Temperature Range .. –65°C to 150°C RT Voltage ... –0.3V to 5V Lead Temperature (Soldering, 10 sec) SYNC Voltage .. –0.3V to 5.5V FE Package ...300°C
pin conFiguraTion
TOP VIEW TOP VIEW NC NC C1 C2 NC NC C1 1 20 C2 28 27 26 25 24 23 E1 2 19 E2 E1 1 22 E2 VIN1 3 18 VIN2 VIN1 2 21 VIN2 PG1 4 17 PG2 PG1 3 20 PG2 FB1 5 21 16 FB2 FB1 4 29 19 FB2 GND GND OV/UV 6 15 SS2 OV/UV 5 18 SS2 RT 7 14 SHOUT RT 6 17 SHOUT SS1 8 13 C3 SS1 7 16 C3 SYNC SYNC 8 15 NC 9 12 GND 9 10 11 12 13 14 GND 10 11 GND GND GND GND GND GND GND FE PACKAGE 20-LEAD PLASTIC TSSOP UFD PACKAGE θJA = 38°C/W 28-LEAD (4mm × 5mm) PLASTIC QFN EXPOSED PAD (PIN 21) IS GND, MUST BE SOLDERED TO PCB θJA = 44°C/W, θJC = 8°C/W EXPOSED PAD (PIN 29) IS GND, MUST BE SOLDERED TO PCB 8471fd 2 For more information www.linear.com/8471 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Related Parts
absoluTe MaxiMuM raTings (Note 1)
VIN1, VIN2 Voltages ... –0.3V to 50V SS1, SS2 ... –0.3V to 2.5V C1, C2 Voltages .. –0.4V to 50V FB1, FB2 Voltages ... –2.5V to 2.5V E1, E2 Voltages ... –60V to 50V PG1, PG2 Voltages ... –0.3V to 50V VC1 to VE1 and VC2 to VE2 Voltages .. –0.4V to 60V OV/UV Voltage ... –0.3V to 5V VIN1 to VE1 and VIN2 to VE2 Voltages SHOUT Voltage ... –0.3V to 50V Low Side Configurations (Note 6) .. –0.4V to 40V Operating Junction Temperature Range High Side Configurations (Note 6) ... –0.4V to 60V LT8471E (Notes 2, 5) ... –40°C to 125°C VIN1 to VC1 and VIN2 to VC2 Voltages LT8471I (Notes 2, 5) .. –40°C to 125°C High Side Configurations (Note 6) ... –0.4V to 40V LT8471H (Notes 2, 5) ... –40°C to 150°C C3 Voltage ... –0.4V to 50V Storage Temperature Range .. –65°C to 150°C RT Voltage ... –0.3V to 5V Lead Temperature (Soldering, 10 sec) SYNC Voltage .. –0.3V to 5.5V FE Package ...300°C
pin conFiguraTion
TOP VIEW TOP VIEW NC NC C1 C2 NC NC C1 1 20 C2 28 27 26 25 24 23 E1 2 19 E2 E1 1 22 E2 VIN1 3 18 VIN2 VIN1 2 21 VIN2 PG1 4 17 PG2 PG1 3 20 PG2 FB1 5 21 16 FB2 FB1 4 29 19 FB2 GND GND OV/UV 6 15 SS2 OV/UV 5 18 SS2 RT 7 14 SHOUT RT 6 17 SHOUT SS1 8 13 C3 SS1 7 16 C3 SYNC SYNC 8 15 NC 9 12 GND 9 10 11 12 13 14 GND 10 11 GND GND GND GND GND GND GND FE PACKAGE 20-LEAD PLASTIC TSSOP UFD PACKAGE θJA = 38°C/W 28-LEAD (4mm × 5mm) PLASTIC QFN EXPOSED PAD (PIN 21) IS GND, MUST BE SOLDERED TO PCB θJA = 44°C/W, θJC = 8°C/W EXPOSED PAD (PIN 29) IS GND, MUST BE SOLDERED TO PCB 8471fd 2 For more information www.linear.com/8471 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Related Parts
