Datasheet LTM2883 (Analog Devices) - 7

ManufacturerAnalog Devices
DescriptionSPI/Digital or I2C μModule Isolator with Adjustable ±12.5V and 5V Regulated Power
Pages / Page36 / 7 — ISOLATION CHARACTERISTICS. Note 1:. Note 5:. Note 2:. Note 6:. Note 3:. …
File Format / SizePDF / 1.5 Mb
Document LanguageEnglish

ISOLATION CHARACTERISTICS. Note 1:. Note 5:. Note 2:. Note 6:. Note 3:. Note 7:. Note 4:

ISOLATION CHARACTERISTICS Note 1: Note 5: Note 2: Note 6: Note 3: Note 7: Note 4:

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LTM2883
ISOLATION CHARACTERISTICS Note 1:
Stresses beyond those listed under Absolute Maximum Ratings Continuous operation above specified maximum operating junction may cause permanent damage to the device. Exposure to any Absolute temperature may result in device degradation or failure. Maximum Rating condition for extended periods may affect device
Note 5:
Device considered a 2-terminal device. Pin group A1 through B8 reliability and lifetime. shorted together and pin group K1 through L8 shorted together.
Note 2:
Guaranteed by design and not subject to production test.
Note 6:
The rated dielectric insulation voltage should not be interpreted as
Note 3:
Maximum data rate is guaranteed by other measured parameters a continuous voltage rating. and is not tested directly.
Note 7:
In accordance with UL1577, each device is proof tested for the
Note 4:
This module includes overtemperature protection that is intended 2500VRMS rating by applying the equivalent positive and negative peak to protect the device during momentary overload conditions. Junction voltage multiplied by an acceleration factor of 1.2 for one second. temperature will exceed 125°C when overtemperature protection is active. 2883fd For more information www.linear.com/LTM2883 7 Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Switching Characteristics Isolation Characteristics Typical Performance Characteristics Pin Functions Block Diagram Test Circuits Applications Information Package Description Typical Application Related Parts