Datasheet ADR02ACHIPS (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Ultracompact, Precision 5.0 V Voltage Reference |
| Pages / Page | 8 / 5 — Data Sheet. ADR02ACHIPS. OUTLINE DIMENSIONS DIE PAD DESCRIPTIONS |
| File Format / Size | PDF / 176 Kb |
| Document Language | English |
Data Sheet. ADR02ACHIPS. OUTLINE DIMENSIONS DIE PAD DESCRIPTIONS
Model Line for this Datasheet
Text Version of Document
Data Sheet ADR02ACHIPS OUTLINE DIMENSIONS DIE PAD DESCRIPTIONS
Die center is the reference location at 0.0 µm × 0.0 µm. Pad coordinates are to the center of each pad. Die edges may contain cosmetic damage from the die separation process. This cosmetic damage is not considered a reliability issue.
Table 4. Pad Mnemonics, Function Descriptions, Coordinates Pad Number Mnemonic Description Pad Coordinates (µm)
1 NC No Connect Not applicable 2 VIN Input Supply Voltage −195 × +306 3 TEMP Temperature Adjustment −180 × −306 4 GND Ground −40 × −306 5 TRIM Trim +281 × −272 6A VOUT (SENSE) Connect Output to Both Pads +281 × +166 6B VOUT (FORCE) Connect Output to Both Pads +217 × +306
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach Expoxy adhesive Bonding Method Gold ball or Aluminum wedge Bonding Sequence GND first
ORDERING GUIDE Model Functional Temperature Range Package Description/Quantity Package Option
ADR02ACHIPS −40°C to +125°C Waffle Pack/400 DIE Rev. 0 | Page 5 of 8 Document Outline FEATURES GENERAL DESCRIPTION ADR02 CHIP DIMENSIONS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION OUTLINE DIMENSIONS DIE PAD DESCRIPTIONS ORDERING GUIDE
Die center is the reference location at 0.0 µm × 0.0 µm. Pad coordinates are to the center of each pad. Die edges may contain cosmetic damage from the die separation process. This cosmetic damage is not considered a reliability issue.
Table 4. Pad Mnemonics, Function Descriptions, Coordinates Pad Number Mnemonic Description Pad Coordinates (µm)
1 NC No Connect Not applicable 2 VIN Input Supply Voltage −195 × +306 3 TEMP Temperature Adjustment −180 × −306 4 GND Ground −40 × −306 5 TRIM Trim +281 × −272 6A VOUT (SENSE) Connect Output to Both Pads +281 × +166 6B VOUT (FORCE) Connect Output to Both Pads +217 × +306
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach Expoxy adhesive Bonding Method Gold ball or Aluminum wedge Bonding Sequence GND first
ORDERING GUIDE Model Functional Temperature Range Package Description/Quantity Package Option
ADR02ACHIPS −40°C to +125°C Waffle Pack/400 DIE Rev. 0 | Page 5 of 8 Document Outline FEATURES GENERAL DESCRIPTION ADR02 CHIP DIMENSIONS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION OUTLINE DIMENSIONS DIE PAD DESCRIPTIONS ORDERING GUIDE
