Datasheet LTM4642 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | 20VIN, Dual 4A or Single 8A DC/DC μModule Regulator |
| Pages / Page | 32 / 2 — absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). orDer inForMaTion … |
| File Format / Size | PDF / 1.1 Mb |
| Document Language | English |
absoluTe MaxiMuM raTings. pin conFiguraTion. (Note 1). orDer inForMaTion http://www.linear.com/product/LTM4642#orderinfo
Model Line for this Datasheet
Text Version of Document
LTM4642
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
V 1 2 3 4 5 6 7 IN1, VIN2, SW1, SW2, CPWR .. –0.3V to 22V INTV SW2 CC, DRVCC, PGOOD1,2, RUN1,2, EXTVCC, A GND VFB1, VFB2 (Note 4) ..–0.3V to INTVCC + 0.3V VOUT2 RUN2 PHASMD COMP1, COMP2 (Note 4) .. –0.3V to 2.7V B VIN2 MODE/PLLIN VFB2 TRACK/SS2 CPWR MODE/PLLIN, FREQ, PHASMD, C PGOOD2 V GND COMP2 CLKOUT RNG1 ...–0.3V to INTVCC + 0.3V EXTV D CC VOUT1, VOUT2, VOUTS1 ... –0.3V to 6V GND SGNDCOMP1 FREQ GND DRVCC INTVCC V – E OUTS ...0.3V to 2.75V V V – OUTS V OUTS1 FB1 PGOOD1GND TK/SS1, TK/SS2 ... 0.3V to 5V F Internal Operating Temperature Range VOUT1 RUN1 VRNG1 TRACK/SS1 G VIN1 (Note 2) .. –40°C to 125°C SW1 Maximum Reflow Body Temperature .. 245°C H GND Storage Temperature Range .. –55°C to 125°C BGA Package 56-Lead (9mm × 11.25mm × 4.92mm) TJMAX = 125°C, θJA = 15°C/W, θJP = 4°C/W θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS WEIGHT = 1.2635g
orDer inForMaTion http://www.linear.com/product/LTM4642#orderinfo PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4642EY#PBF SAC305 (RoHS) LTM4642Y e1 BGA 3 –40°C to 125°C LTM4642IY#PBF SAC305 (RoHS) LTM4642Y e1 BGA 3 –40°C to 125°C LTM4642IY SnPb (63/37) LTM4642Y e0 BGA 3 –40°C to 125°C • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures: www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: www.linear.com/leadfree • LGA and BGA Package and Tray Drawings: www.linear.com/packaging
elecTrical characTerisTics The
l
denotes the specifications which apply over the full internal operating temperature range (Note 2), otherwise specifications are at TA = 25°C, VIN = 12V. Per typical application in Figure 27. Specified as each channel. (Note 3) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VIN(DC) Input DC Voltage VIN ≤ 4.5V, Connect CPWR to a Bias > 4.5V l 2.375 20 V VOUT1,2(RANGE) Output Voltage Range VIN = 6V to 20V l 0.6 5.5 V VOUT1,2(DC) Output Voltage, Total Variation CIN = 10µF ×2, COUT = 47µF Ceramic, 100µF POSCAP, with Line and Load RSET = 40.2kΩ VIN = 12V, VOUT = 1.5V, IOUT = 4A l 1.4775 1.5 1.5225 V
Input Specifications
IINRUSH(VIN) Input Inrush Current at Start-Up IOUT = 0A, CIN = 10µF, COUT = 47µF Ceramic and 100µF POSCAP, VOUT = 1.5V 0.25 A VIN = 12V 4642fb 2 For more information www.linear.com/LTM4642 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Package Photograph Design Resources Related Parts
absoluTe MaxiMuM raTings pin conFiguraTion (Note 1)
V 1 2 3 4 5 6 7 IN1, VIN2, SW1, SW2, CPWR .. –0.3V to 22V INTV SW2 CC, DRVCC, PGOOD1,2, RUN1,2, EXTVCC, A GND VFB1, VFB2 (Note 4) ..–0.3V to INTVCC + 0.3V VOUT2 RUN2 PHASMD COMP1, COMP2 (Note 4) .. –0.3V to 2.7V B VIN2 MODE/PLLIN VFB2 TRACK/SS2 CPWR MODE/PLLIN, FREQ, PHASMD, C PGOOD2 V GND COMP2 CLKOUT RNG1 ...–0.3V to INTVCC + 0.3V EXTV D CC VOUT1, VOUT2, VOUTS1 ... –0.3V to 6V GND SGNDCOMP1 FREQ GND DRVCC INTVCC V – E OUTS ...0.3V to 2.75V V V – OUTS V OUTS1 FB1 PGOOD1GND TK/SS1, TK/SS2 ... 0.3V to 5V F Internal Operating Temperature Range VOUT1 RUN1 VRNG1 TRACK/SS1 G VIN1 (Note 2) .. –40°C to 125°C SW1 Maximum Reflow Body Temperature .. 245°C H GND Storage Temperature Range .. –55°C to 125°C BGA Package 56-Lead (9mm × 11.25mm × 4.92mm) TJMAX = 125°C, θJA = 15°C/W, θJP = 4°C/W θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS WEIGHT = 1.2635g
orDer inForMaTion http://www.linear.com/product/LTM4642#orderinfo PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4642EY#PBF SAC305 (RoHS) LTM4642Y e1 BGA 3 –40°C to 125°C LTM4642IY#PBF SAC305 (RoHS) LTM4642Y e1 BGA 3 –40°C to 125°C LTM4642IY SnPb (63/37) LTM4642Y e0 BGA 3 –40°C to 125°C • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures: www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: www.linear.com/leadfree • LGA and BGA Package and Tray Drawings: www.linear.com/packaging
elecTrical characTerisTics The
l
denotes the specifications which apply over the full internal operating temperature range (Note 2), otherwise specifications are at TA = 25°C, VIN = 12V. Per typical application in Figure 27. Specified as each channel. (Note 3) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VIN(DC) Input DC Voltage VIN ≤ 4.5V, Connect CPWR to a Bias > 4.5V l 2.375 20 V VOUT1,2(RANGE) Output Voltage Range VIN = 6V to 20V l 0.6 5.5 V VOUT1,2(DC) Output Voltage, Total Variation CIN = 10µF ×2, COUT = 47µF Ceramic, 100µF POSCAP, with Line and Load RSET = 40.2kΩ VIN = 12V, VOUT = 1.5V, IOUT = 4A l 1.4775 1.5 1.5225 V
Input Specifications
IINRUSH(VIN) Input Inrush Current at Start-Up IOUT = 0A, CIN = 10µF, COUT = 47µF Ceramic and 100µF POSCAP, VOUT = 1.5V 0.25 A VIN = 12V 4642fb 2 For more information www.linear.com/LTM4642 Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Package Photograph Design Resources Related Parts
