LTM4601A/LTM4601A-1 (Note 1)ABSOLUTE MAXIMUM RATINGS INTVCC, DRVCC, VOUT_LCL, VOUT (VOUT ≤ 3.3V with VIN ...–0.3V to 20V DIFFV + – OUT) .. –0.3V to 6V VOSNS , VOSNS ..–0.3V to INTVCC + 0.3V PLLIN, TRACK/SS, MPGM, MARG0, MARG1, Operating Temperature Range (Note 2)..–40°C to 85°C PGOOD, fSET ..–0.3V to INTVCC + 0.3V Junction Temperature ... 125°C RUN ...–0.3V to 5V Storage Temperature Range .. –55°C to 125°C VFB, COMP ..–0.3V to 2.7V Peak Solder Reflow Body Temperature ... 245°C PIN CONFIGURATION (See Table 5. Pin Assignment) TOP VIEW TOP VIEW V CC V CC INT PLLIN TRACK/SS RUN COMP MPGM INT PLLIN TRACK/SS RUN COMP MPGM VIN fSET MTP1 VIN fSET MARG0 MTP1 MTP2 MARG0 MARG1 MTP2 INTVCC MARG1 MTP3 DRVCC INTVCC MTP3 DRVCC PGND VFB V PGOOD PGND FB SGND PGOOD V + SGND OSNS /NC2* DIFFV + OUT/NC3* VOSNS /NC2* VOUT VOUT_LCL DIFFVOUT/NC3* V V – OUT OSNS /NC1* VOUT_LCL BGA PACKAGE V – OSNS /NC1* 133-LEAD (15mm × 15mm × 3.42mm) LGA PACKAGE 133-LEAD (15mm × 15mm × 2.82mm) TJMAX = 125°C, θJA = 15.5°C/W, θJCbottom = 6.5°C/W T θ JMAX = 125°C, θJA = 15°C/W, θJC = 6°C/W JA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS θ WEIGHT = 1.9g, *LTM4601A-1 ONLY JA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS WEIGHT = 1.7g, *LTM4601A-1 ONLY ORDER INFORMATIONPART NUMBERPAD OR BALL FINISHPART MARKING*PACKAGEMSLTEMPERATURE RANGETYPERATING(Note 2)DEVICEFINISH CODE LTM4601AEV#PBF Au (RoHS) LTM4601AV e4 LGA 3 –40°C to 85°C LTM4601AIV#PBF Au (RoHS) LTM4601AV e4 LGA 3 –40°C to 85°C LTM4601AEV-1#PBF Au (RoHS) LTM4601AV-1 e4 LGA 3 –40°C to 85°C LTM4601AIV-1#PBF Au (RoHS) LTM4601AV-1 e4 LGA 3 –40°C to 85°C LTM4601AEY#PBF SAC305 (RoHS) LTM4601AY e1 BGA 3 –40°C to 85°C LTM4601AEY-1#PBF SAC305 (RoHS) LTM4601AY-1 e1 BGA 3 –40°C to 85°C LTM4601AIY-1#PBF SAC305 (RoHS) LTM4601AY-1 e1 BGA 3 –40°C to 85°C LTM4601AIY#PBF SAC305 (RoHS) LTM4601AY e1 BGA 3 –40°C to 85°C LTM4601AIY SnPb (63/37) LTM4601AY e0 BGA 3 –40°C to 85°C LTM4601AIY-1 SnPb (63/37) LTM4601AY-1 e0 BGA 3 –40°C to 85°C Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures: container. Pad or ball finish code is per IPC/JEDEC J-STD-609. www.linear.com/umodule/pcbassembly • Terminal Finish Part Marking: • LGA and BGA Package and Tray Drawings: www.linear.com/leadfree www.linear.com/packaging 4601afe 2 For more information www.linear.com/LTM4601A Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Simplified Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Revision History Package Photos Related Parts