Datasheet ADE9000 (Analog Devices) - 7

ManufacturerAnalog Devices
DescriptionHigh Performance, Multiphase Energy, and Power Quality Measurement IC
Pages / Page72 / 7 — Data Sheet. ADE9000. Parameter. Min. Typ. Max. Unit. Test …
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Data Sheet. ADE9000. Parameter. Min. Typ. Max. Unit. Test Conditions/Comments

Data Sheet ADE9000 Parameter Min Typ Max Unit Test Conditions/Comments

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Data Sheet ADE9000 Parameter Min Typ Max Unit Test Conditions/Comments
INTERNAL VOLTAGE REFERENCE Nominal = 1.25 V ± 1 mV Voltage Reference 1.250 V TA = 25°C, REF pin Temperature Coefficient2 ±5 ±20 ppm/°C TA = −40°C to +85°C, tested during device characterization EXTERNAL VOLTAGE REFERENCE Input Voltage (REF) 1.2 or V REFGND must be tied to GND, AGND, and DGND, 1.25 a 1.25 V external reference is preferred; the FS values mentioned in this data sheet are for a voltage reference of 1.25 V Input Impedance 7.5 kΩ TEMPERATURE SENSOR Temperature Accuracy ±2 °C −10°C to +40°C ±3 °C −40°C to +85°C Temperature Readout Step Size 0.3 °C CRYSTAL OSCILLATOR All specifications use CLKIN = 24.576 MHz ± 30 ppm Input Clock Frequency 24.33 24.576 24.822 MHz Internal Capacitance on CLKIN, CLKOUT 4 pF Internal Feedback Resistance Between 2.45 MΩ CLKIN and CLKOUT Transconductance (gm) 5 8 mA/V EXTERNAL CLOCK INPUT Input Clock Frequency 24.330 24.576 24.822 MHz ±1% Duty Cycle2 45:55 50:50 55:45 % CLKIN Logic Input Voltage 3.3 V tolerant High, VINH 1.2 V VDD = 2.97 V to 3.63 V Low, VINL 0.5 V VDD = 2.97 V to 3.63 V LOGIC INPUTS (PM0, PM1, RESET, MOSI, SCLK, and SS) Input Voltage VINH 2.4 V VINL 0.8 V Input Current, IIN 15 µA VIN = 0 V Internal Capacitance, CIN 10 pF LOGIC OUTPUTS MISO, IRQ0, and IRQ 1 Output Voltage High, VOH 2.4 V ISOURCE = 4 mA Low, VOL 0.8 V ISINK = 4 mA Internal Capacitance, CIN 10 pF C1, CF2, CF3, and CF4 Output Voltage VOH 2.4 V ISOURCE = 7 mA VOL 0.8 V ISINK = 8 mA CIN 10 pF LOW DROPOUT REGULATORS (LDOs) AVDD 1.9 V DVDD 1.7 V Rev. A | Page 7 of 72 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION REVISION HISTORY TYPICAL APPLICATIONS CIRCUIT SPECIFICATIONS TIMING CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS ENERGY LINEARITY OVER SUPPLY AND TEMPERATURE ENERGY ERROR OVER FREQUENCY AND POWER FACTOR ENERGY LINEARITY REPEATABILITY RMS LINEARITY OVER TEMPERATURE AND RMS ERROR OVER FREQUENCY ENERGY AND RMS LINEARITY WITH INTEGRATOR ON ENERGY AND RMS ERROR OVER FREQUENCY WITH INTEGRATOR ON SIGNAL-TO-NOISE RATIO PERFORMANCE TEST CIRCUIT TERMINOLOGY THEORY OF OPERATION MEASUREMENTS Current Channel ADC_REDIRECT Multiplexer Current Channel Gain, xIGAIN IB Calculation Using ICONSEL High-Pass Filter Digital Integrator Phase Compensation Multipoint Phase and Gain Calibration Voltage Channel RMS and Power Measurements Total and Fundamental RMS Total and Fundamental Active Power Total and Fundamental Reactive Power Total and Fundamental Apparent Power No Load Detection, Energy Accumulation, and Power Accumulation Features No Load Detection Feature Energy Accumulation Power Accumulation Digital to Frequency Conversion—CFx Output Energy and Phase Selection Configuring the CFx Pulse Width CFx Pulse Sign Clearing the CFx Accumulator POWER QUALITY MEASUREMENTS Zero-Crossing Detection CF3/ZX Zero-Crossing Timeout Line Period Calculation Angle Measurement Phase Sequence Error Detection Fast RMS½ Measurement 10 Cycle RMS/12 Cycle RMS Dip and Swell Indication Overcurrent Indication Peak Detection Power Factor Total Harmonic Distortion (THD) Resampling 128 Points per Cycle Temperature WAVEFORM BUFFER INTERRUPTS/EVENTS ACCESSING ON-CHIP DATA SPI PROTOCOL OVERVIEW ADDITIONAL COMMUNICATION VERIFICATION REGISTERS CRC OF CONFIGURATION REGISTERS CONFIGURATION LOCK REGISTER MAP REGISTER DETAILS OUTLINE DIMENSIONS ORDERING GUIDE