Datasheet ADR510 (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | 1.0 V Precision Low Noise Shunt Voltage Reference |
| Pages / Page | 12 / 4 — ADR510. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE. Parameter … |
| Revision | B |
| File Format / Size | PDF / 394 Kb |
| Document Language | English |
ADR510. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE. Parameter Rating. Table 4. Thermal Resistance. Package Type. θJC Unit
Model Line for this Datasheet
Text Version of Document
ADR510 ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Reverse Current 25 mA soldered in a circuit board for surface-mount packages. Package Forward Current 20 mA power dissipation = (TJMAX − TA)/θJA. Storage Temperature Range −65°C to +150°C
Table 4. Thermal Resistance
Operating Temperature Range −40°C to +85°C
Package Type θ
Junction Temperature Range −65°C to +150°C
JA θJC Unit
Lead Temperature (Soldering, 60 sec) 300°C 3-Lead SOT-23-3 (RT-3) 230 146 °C/W Stresses above those listed under Absolute Maximum Ratings
ESD CAUTION
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. B | Page 4 of 12 Document Outline FEATURES APPLICATIONS PIN CONFIGURATION GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS PARAMETER DEFINITIONS TEMPERATURE COEFFICIENT THERMAL HYSTERESIS APPLICATIONS INFORMATION ADJUSTABLE PRECISION VOLTAGE SOURCE OUTPUT VOLTAGE TRIM USING THE ADR510 WITH PRECISION DATA CONVERTERS PRECISE NEGATIVE VOLTAGE REFERENCE OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for the worst-case conditions, that is, a device Reverse Current 25 mA soldered in a circuit board for surface-mount packages. Package Forward Current 20 mA power dissipation = (TJMAX − TA)/θJA. Storage Temperature Range −65°C to +150°C
Table 4. Thermal Resistance
Operating Temperature Range −40°C to +85°C
Package Type θ
Junction Temperature Range −65°C to +150°C
JA θJC Unit
Lead Temperature (Soldering, 60 sec) 300°C 3-Lead SOT-23-3 (RT-3) 230 146 °C/W Stresses above those listed under Absolute Maximum Ratings
ESD CAUTION
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. B | Page 4 of 12 Document Outline FEATURES APPLICATIONS PIN CONFIGURATION GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS PARAMETER DEFINITIONS TEMPERATURE COEFFICIENT THERMAL HYSTERESIS APPLICATIONS INFORMATION ADJUSTABLE PRECISION VOLTAGE SOURCE OUTPUT VOLTAGE TRIM USING THE ADR510 WITH PRECISION DATA CONVERTERS PRECISE NEGATIVE VOLTAGE REFERENCE OUTLINE DIMENSIONS ORDERING GUIDE
