Datasheet ADP5133 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Dual 3 MHz, 800 mA Buck Regulators in WLCSP |
| Pages / Page | 24 / 5 — Data Sheet. ADP5133. ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL … |
| Revision | A |
| File Format / Size | PDF / 803 Kb |
| Document Language | English |
Data Sheet. ADP5133. ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE. Parameter. Rating. Table 6. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
link to page 17 link to page 17
Data Sheet ADP5133 ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE Parameter Rating
θJA and ΨJB are specified for the worst-case conditions, that is, a VIN1, VIN2 to AGND −0.3 V to +6 V device soldered in a circuit board for surface-mount packages. VIN2 to VIN1 −0.3 V to +0.3 V
Table 6. Thermal Resistance
PGND1, PGND2 to AGND −0.3 V to +0.3 V VOUT1, VOUT2, FB1, FB2 EN1, EN2, −0.3 V to
Package Type θJA ΨJB Unit
MODE to AGND (VIN1 + 0.3 V) 16-Ball, 0.5 mm Pitch WLCSP 57 14 °C/W SW1 to PGND1 −0.3 V to (VIN1 + 0.3 V) SW2 to PGND2 −0.3 V to
ESD CAUTION
(VIN2 + 0.3 V) Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. For detailed information on power dissipation, see the Power Dissipation and Thermal Considerations section. Rev. A | Page 5 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS GENERAL SPECIFICATIONS BUCK1 AND BUCK2 SPECIFICATIONS INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION POWER MANAGEMENT UNIT Thermal Protection Undervoltage Lockout Enable/Shutdown BUCK1 AND BUCK2 Control Scheme PWM Mode Auto PSM/PWM Operation PSM Current Threshold Oscillator/Phasing of Inductor Switching Short-Circuit Protection Soft Start Current Limit 100% Duty Operation Active Pull-Downs APPLICATIONS INFORMATION BUCK EXTERNAL COMPONENT SELECTION Feedback Resistors Inductor Output Capacitor Input Capacitor POWER DISSIPATION AND THERMAL CONSIDERATIONS BUCK REGULATOR POWER DISSIPATION JUNCTION TEMPERATURE PCB LAYOUT GUIDELINES TYPICAL APPLICATION SCHEMATICS OUTLINE DIMENSIONS ORDERING GUIDE
Data Sheet ADP5133 ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE Parameter Rating
θJA and ΨJB are specified for the worst-case conditions, that is, a VIN1, VIN2 to AGND −0.3 V to +6 V device soldered in a circuit board for surface-mount packages. VIN2 to VIN1 −0.3 V to +0.3 V
Table 6. Thermal Resistance
PGND1, PGND2 to AGND −0.3 V to +0.3 V VOUT1, VOUT2, FB1, FB2 EN1, EN2, −0.3 V to
Package Type θJA ΨJB Unit
MODE to AGND (VIN1 + 0.3 V) 16-Ball, 0.5 mm Pitch WLCSP 57 14 °C/W SW1 to PGND1 −0.3 V to (VIN1 + 0.3 V) SW2 to PGND2 −0.3 V to
ESD CAUTION
(VIN2 + 0.3 V) Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. For detailed information on power dissipation, see the Power Dissipation and Thermal Considerations section. Rev. A | Page 5 of 24 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS GENERAL SPECIFICATIONS BUCK1 AND BUCK2 SPECIFICATIONS INPUT AND OUTPUT CAPACITOR, RECOMMENDED SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION POWER MANAGEMENT UNIT Thermal Protection Undervoltage Lockout Enable/Shutdown BUCK1 AND BUCK2 Control Scheme PWM Mode Auto PSM/PWM Operation PSM Current Threshold Oscillator/Phasing of Inductor Switching Short-Circuit Protection Soft Start Current Limit 100% Duty Operation Active Pull-Downs APPLICATIONS INFORMATION BUCK EXTERNAL COMPONENT SELECTION Feedback Resistors Inductor Output Capacitor Input Capacitor POWER DISSIPATION AND THERMAL CONSIDERATIONS BUCK REGULATOR POWER DISSIPATION JUNCTION TEMPERATURE PCB LAYOUT GUIDELINES TYPICAL APPLICATION SCHEMATICS OUTLINE DIMENSIONS ORDERING GUIDE
