Datasheet LTC3419 (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | Dual Monolithic 600mA Synchronous Step-Down Regulator |
| Pages / Page | 16 / 6 — TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, VIN = 3.6V, unless … |
| File Format / Size | PDF / 264 Kb |
| Document Language | English |
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, VIN = 3.6V, unless otherwise noted. Load Step. PIN FUNCTIONS (DD/MS)
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LTC3419
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, VIN = 3.6V, unless otherwise noted. Load Step Load Step Load Step
VOUT VOUT VOUT 100mV/DIV 100mV/DIV 100mV/DIV AC-COUPLED AC-COUPLED AC-COUPLED IL I I L L 500mA/DIV 500mA/DIV 500mA/DIV ILOAD ILOAD ILOAD 500mA/DIV 500mA/DIV 500mA/DIV 3419 G19 3419 G20 3419 G21 20μs/DIV 20μs/DIV 20μs/DIV VIN = 3.6V VIN = 3.6V VIN = 3.6V VOUT = 1.8V VOUT = 1.8V VOUT = 1.2V ILOAD = 0A TO 600mA ILOAD = 40mA TO 600mA ILOAD = 40mA TO 600mA
PIN FUNCTIONS (DD/MS) VFB1 (Pin 1/Pin 1):
Regulator 1 Output Feedback. Receives
SW2 (Pin 6/Pin 8):
Regulator 2 Switch Node Connection the feedback voltage from the external resistive divider to the Inductor. This pin swings from VIN to GND. across the regulator 1 output. Nominal voltage for this
RUN2 (Pin 7/Pin 9):
Regulator 2 Enable. Forcing this pin pin is 0.6V. to VIN enables regulator 2, while forcing it to GND causes
RUN1 (Pin 2/Pin 2):
Regulator 1 Enable. Forcing this pin regulator 2 to shut down. to VIN enables regulator 1, while forcing it to GND causes
V
regulator 1 to shut down.
FB2 (Pin 8/Pin 10):
Regulator 2 Output Feedback. Receives the feedback voltage from the external resistive divider
MODE (Pin 3/Pin 3):
Mode Select Input. To select pulse- across the regulator 2 output. Nominal voltage for this skipping mode, tie to VIN. Grounding this pin selects Burst pin is 0.6V. Mode operation. Do not leave this pin fl oating.
Exposed Pad (Pin 9/NA):
Ground. The Exposed Pad must
SW1 (Pin 4/Pin 4):
Regulator 1 Switch Node Connection be soldered to PCB for optimal thermal performance. to the Inductor. This pin swings from VIN to GND.
GND (NA/Pins 5, 6):
Ground. Connect to the (–) terminal
VIN (Pin 5/Pin 7):
Main Power Supply. Must be closely of COUT, and the (–) terminal of CIN. Pin 5 of the MS de-coupled to GND. package must be soldered to the PC board for optimal thermal performance. 3419fa 6
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, VIN = 3.6V, unless otherwise noted. Load Step Load Step Load Step
VOUT VOUT VOUT 100mV/DIV 100mV/DIV 100mV/DIV AC-COUPLED AC-COUPLED AC-COUPLED IL I I L L 500mA/DIV 500mA/DIV 500mA/DIV ILOAD ILOAD ILOAD 500mA/DIV 500mA/DIV 500mA/DIV 3419 G19 3419 G20 3419 G21 20μs/DIV 20μs/DIV 20μs/DIV VIN = 3.6V VIN = 3.6V VIN = 3.6V VOUT = 1.8V VOUT = 1.8V VOUT = 1.2V ILOAD = 0A TO 600mA ILOAD = 40mA TO 600mA ILOAD = 40mA TO 600mA
PIN FUNCTIONS (DD/MS) VFB1 (Pin 1/Pin 1):
Regulator 1 Output Feedback. Receives
SW2 (Pin 6/Pin 8):
Regulator 2 Switch Node Connection the feedback voltage from the external resistive divider to the Inductor. This pin swings from VIN to GND. across the regulator 1 output. Nominal voltage for this
RUN2 (Pin 7/Pin 9):
Regulator 2 Enable. Forcing this pin pin is 0.6V. to VIN enables regulator 2, while forcing it to GND causes
RUN1 (Pin 2/Pin 2):
Regulator 1 Enable. Forcing this pin regulator 2 to shut down. to VIN enables regulator 1, while forcing it to GND causes
V
regulator 1 to shut down.
FB2 (Pin 8/Pin 10):
Regulator 2 Output Feedback. Receives the feedback voltage from the external resistive divider
MODE (Pin 3/Pin 3):
Mode Select Input. To select pulse- across the regulator 2 output. Nominal voltage for this skipping mode, tie to VIN. Grounding this pin selects Burst pin is 0.6V. Mode operation. Do not leave this pin fl oating.
Exposed Pad (Pin 9/NA):
Ground. The Exposed Pad must
SW1 (Pin 4/Pin 4):
Regulator 1 Switch Node Connection be soldered to PCB for optimal thermal performance. to the Inductor. This pin swings from VIN to GND.
GND (NA/Pins 5, 6):
Ground. Connect to the (–) terminal
VIN (Pin 5/Pin 7):
Main Power Supply. Must be closely of COUT, and the (–) terminal of CIN. Pin 5 of the MS de-coupled to GND. package must be soldered to the PC board for optimal thermal performance. 3419fa 6
