Datasheet LT3505 (Analog Devices) - 23
| Manufacturer | Analog Devices |
| Description | 1.2A, Step-Down Switching Regulator in 3mm × 3mm DFN |
| Pages / Page | 24 / 23 — DD Package. 8-Lead Plastic DFN (3mm. 3mm). MS8E Package. 8-Lead Plastic … |
| File Format / Size | PDF / 832 Kb |
| Document Language | English |
DD Package. 8-Lead Plastic DFN (3mm. 3mm). MS8E Package. 8-Lead Plastic MSOP
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Text Version of Document
LT3505 PACKAGE DESCRIPTION
DD Package 8-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1698) R = 0.115 0.38 ± 0.10 TYP 5 8 0.675 ±0.05 3.5 ±0.05 1.65 ±0.05 3.00 ±0.10 1.65 ± 0.10 2.15 ±0.05 (2 SIDES) (4 SIDES) (2 SIDES) PIN 1 TOP MARK PACKAGE (NOTE 6) OUTLINE (DD) DFN 1203 4 1 0.25 ± 0.05 0.200 REF 0.75 ±0.05 0.25 ± 0.05 0.50 0.50 BSC BSC 2.38 ±0.10 2.38 ±0.05 0.00 – 0.05 (2 SIDES) (2 SIDES) BOTTOM VIEW—EXPOSED PAD RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE OUTLINE M0-229 VARIATION OF (WEED-1) MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 2. DRAWING NOT TO SCALE 5. EXPOSED PAD SHALL BE SOLDER PLATED 3. ALL DIMENSIONS ARE IN MILLIMETERS 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON TOP AND BOTTOM OF PACKAGE
MS8E Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1662) 2.794 ± 0.102 0.889 ± 0.127 BOTTOM VIEW OF (.110 ± .004) (.035 ± .005) EXPOSED PAD OPTION 3.00 ± 0.102 2.06 ± 0.102 (.118 ± .004) 0.52 1 (.081 ± .004) (NOTE 3) 8 7 6 5 (.0205) REF 1.83 5.23 ± 0.102 (.206) 2.083 ± 0.102 3.20 – 3.45 (.072 ± .004) MIN (.082 ± .004) (.126 – .136) 4.90 ± 0.152 3.00 ± 0.102 (.193 ± .006) (.118 ± .004) (NOTE 4) 0.42 ± 0.038 0.65 (.0165 ± .0015) (.0256) TYP BSC 8 1 2 3 4 RECOMMENDED SOLDER PAD LAYOUT 1.10 0.86 (.043) (.034) DETAIL “A” DETAIL “A” MAX REF 0.254 0.18 (.010) 0° – 6° TYP (.007) SEATING GAUGE PLANE PLANE 0.22 – 0.38 0.127 ± 0.076 (.009 – .015) 0.53 ± 0.152 (.005 ± .003) TYP 0.65 MSOP (MS8E) 0603 (.021 ± .006) (.0256) BSC NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 3505fc Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 23
DD Package 8-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1698) R = 0.115 0.38 ± 0.10 TYP 5 8 0.675 ±0.05 3.5 ±0.05 1.65 ±0.05 3.00 ±0.10 1.65 ± 0.10 2.15 ±0.05 (2 SIDES) (4 SIDES) (2 SIDES) PIN 1 TOP MARK PACKAGE (NOTE 6) OUTLINE (DD) DFN 1203 4 1 0.25 ± 0.05 0.200 REF 0.75 ±0.05 0.25 ± 0.05 0.50 0.50 BSC BSC 2.38 ±0.10 2.38 ±0.05 0.00 – 0.05 (2 SIDES) (2 SIDES) BOTTOM VIEW—EXPOSED PAD RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS NOTE: 1. DRAWING TO BE MADE A JEDEC PACKAGE 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE OUTLINE M0-229 VARIATION OF (WEED-1) MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 2. DRAWING NOT TO SCALE 5. EXPOSED PAD SHALL BE SOLDER PLATED 3. ALL DIMENSIONS ARE IN MILLIMETERS 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON TOP AND BOTTOM OF PACKAGE
MS8E Package 8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1662) 2.794 ± 0.102 0.889 ± 0.127 BOTTOM VIEW OF (.110 ± .004) (.035 ± .005) EXPOSED PAD OPTION 3.00 ± 0.102 2.06 ± 0.102 (.118 ± .004) 0.52 1 (.081 ± .004) (NOTE 3) 8 7 6 5 (.0205) REF 1.83 5.23 ± 0.102 (.206) 2.083 ± 0.102 3.20 – 3.45 (.072 ± .004) MIN (.082 ± .004) (.126 – .136) 4.90 ± 0.152 3.00 ± 0.102 (.193 ± .006) (.118 ± .004) (NOTE 4) 0.42 ± 0.038 0.65 (.0165 ± .0015) (.0256) TYP BSC 8 1 2 3 4 RECOMMENDED SOLDER PAD LAYOUT 1.10 0.86 (.043) (.034) DETAIL “A” DETAIL “A” MAX REF 0.254 0.18 (.010) 0° – 6° TYP (.007) SEATING GAUGE PLANE PLANE 0.22 – 0.38 0.127 ± 0.076 (.009 – .015) 0.53 ± 0.152 (.005 ± .003) TYP 0.65 MSOP (MS8E) 0603 (.021 ± .006) (.0256) BSC NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 3505fc Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa- tion that the interconnection of its circuits as described herein will not infringe on existing patent rights. 23
