Datasheet LTM4623 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | Ultrathin 20VIN, 3A Step-Down DC/DC µModule Regulator |
| Pages / Page | 28 / 2 — (Note 1). (See Pin Functions, Pin Configuration T. able). PART MARKING*. … |
| Revision | D |
| File Format / Size | PDF / 305 Kb |
| Document Language | English |
(Note 1). (See Pin Functions, Pin Configuration T. able). PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
Model Line for this Datasheet
Text Version of Document
LTM4623 ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION
(Note 1) (See Pin Functions, Pin Configuration T able)
VIN, SVIN .. –0.3V to 22V V TOP VIEW OUT ...–0.3V to SVIN or 6V CLKOUT RUN ... –0.3V to 22V CLKIN SVIN INTVCC .. –0.3V to 3.6V 5 VIN SGND PGOOD, MODE, TRACK/SS, FREQ, MODE FREQ 4 INTVCC PHMODE, CLKIN .. –0.3V to INTV RUN CC 3 GND Internal Operating Junction Temperature Range PHMODE TRACK/SS PGOOD 2 (Notes 2, 5) .. –40°C to 125°C FB VOUT COMP 1 Storage Temperature Range .. –65°C to 150°C Peak Solder Reflow Body Temperature ...260°C A B C D E LGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 1.82mm) BGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 2.42mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, θJB + θBA = 22°C/W, θJA = 22°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS θ VALUES DETERMINED PER JESD51-12, WEIGHT = 0.5g ORDER INFORMATION
PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (Note 2)
LTM4623EV#PBF Au (RoHS) LTM4623V e4 LGA 3 –40°C to 125°C LTM4623IV#PBF Au (RoHS) LTM4623V e4 LGA 3 –40°C to 125°C LTM4623EY#PBF SAC305 (RoHS) LTM4623Y e1 BGA 3 –40°C to 125°C LTM4623IY#PBF SAC305 (RoHS) LTM4623Y e1 BGA 3 –40°C to 125°C LTM4623IY SnPb (63/37) LTM4623Y e0 BGA 3 –40°C to 125°C • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev D 2 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photos Design Resources Related Parts
(Note 1) (See Pin Functions, Pin Configuration T able)
VIN, SVIN .. –0.3V to 22V V TOP VIEW OUT ...–0.3V to SVIN or 6V CLKOUT RUN ... –0.3V to 22V CLKIN SVIN INTVCC .. –0.3V to 3.6V 5 VIN SGND PGOOD, MODE, TRACK/SS, FREQ, MODE FREQ 4 INTVCC PHMODE, CLKIN .. –0.3V to INTV RUN CC 3 GND Internal Operating Junction Temperature Range PHMODE TRACK/SS PGOOD 2 (Notes 2, 5) .. –40°C to 125°C FB VOUT COMP 1 Storage Temperature Range .. –65°C to 150°C Peak Solder Reflow Body Temperature ...260°C A B C D E LGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 1.82mm) BGA PACKAGE 25-LEAD (6.25mm × 6.25mm × 2.42mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 11°C/W, θJB + θBA = 22°C/W, θJA = 22°C/W, θJA DERIVED FROM 95mm × 76mm PCB WITH 4 LAYERS θ VALUES DETERMINED PER JESD51-12, WEIGHT = 0.5g ORDER INFORMATION
PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (Note 2)
LTM4623EV#PBF Au (RoHS) LTM4623V e4 LGA 3 –40°C to 125°C LTM4623IV#PBF Au (RoHS) LTM4623V e4 LGA 3 –40°C to 125°C LTM4623EY#PBF SAC305 (RoHS) LTM4623Y e1 BGA 3 –40°C to 125°C LTM4623IY#PBF SAC305 (RoHS) LTM4623Y e1 BGA 3 –40°C to 125°C LTM4623IY SnPb (63/37) LTM4623Y e0 BGA 3 –40°C to 125°C • Consult Marketing for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • LGA and BGA Package and Tray Drawings Rev D 2 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photos Design Resources Related Parts
