Datasheet LTM4662 (Analog Devices) - 2
| Manufacturer | Analog Devices |
| Description | Dual 15A or Single 30A DC/DC μModule Regulator |
| Pages / Page | 36 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| Revision | A |
| File Format / Size | PDF / 1.4 Mb |
| Document Language | English |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
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LTM4662
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
TOP VIEW CPWR, VIN1, VIN2 ... –0.3V to 22V 1 2 3 4 5 6 7 8 V TEMP2– SW1, VSW2 ... –2V to 22V A PGOOD1, PGOOD2, RUN1, RUN2, DRVCC, VIN2 INTV TEMP2+ CC, EXTVCC, VOUT1, VOUT2, VOUTS1, B VOUTS2 ... –0.3V to 6V VOUT2 GND TRACK/SS1, TRACK/SS2 ... –0.3V to 5V C FREQ, VRNG, PHASMD, – GND SW2 VRNG SGND VOUTS2 RUN2 MODE_PLLIN ... –0.3V to (INTVCC+0.3) D V – OUTS1 (Note 6) ... –0.3V to VFB1 COMP2B VOUTS2 COMP2A V EXTV FB2 PGOOD2 CC V – E OUTS2 , VFB1 (Note 6).. –0.3V to (INTVCC+0.3V) MODE_ COMP1A, COMP2A (Note 6) ... –0.3V to 2.7V FREQ INTV CPWR TRACK/SS2 PLLIN CLKOUT CC COMP1B, COMP2B, V F FB2 .. –0.3V to 2.7V DRV COMP1B V COMP1A V CC Peak Output Current ...100mA OUTS1 FB1 PGOOD1 DRVCC G Internal Operating Temperature Range (Note 2) .. –40°C to 125°C PHASMD SGND TRACK/SS1 RUN1 H Storage Temperature Range .. –55°C to 125°C – SW1 V GND Peak Solder Reflow Package Body Temperature .. 245°C OUTS1 J VOUT1 TEMP1– K GND VIN1 TEMP1+ L BGA PACKAGE 88-LEAD (15mm × 11.25mm × 5.74mm) TJMAX = 125°C, θJA = 7°C/W, θJCbottom = 1.5°C/W, θJCtop = 3.7°C/W, θJB + θBA ≅ 7°C/W θ VALUES DEFINED PER JESD51-12 WEIGHT = 2.2g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4662EY#PBF LTM4662Y SAC305 (RoHS) e1 LTM4662IY#PBF LTM4662Y BGA 3 –40°C to 125°C LTM4662IY SnPb (63/37) LTM4662Y e0 • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures container. Ball finish code is per IPC/JEDEC J-STD-609. • LGA and BGA Package and Tray Drawings Rev. A 2 For more information www.analog.com Document Outline Operation Applications Information Package Description Package Photo Related Parts Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photo Design Resources Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
TOP VIEW CPWR, VIN1, VIN2 ... –0.3V to 22V 1 2 3 4 5 6 7 8 V TEMP2– SW1, VSW2 ... –2V to 22V A PGOOD1, PGOOD2, RUN1, RUN2, DRVCC, VIN2 INTV TEMP2+ CC, EXTVCC, VOUT1, VOUT2, VOUTS1, B VOUTS2 ... –0.3V to 6V VOUT2 GND TRACK/SS1, TRACK/SS2 ... –0.3V to 5V C FREQ, VRNG, PHASMD, – GND SW2 VRNG SGND VOUTS2 RUN2 MODE_PLLIN ... –0.3V to (INTVCC+0.3) D V – OUTS1 (Note 6) ... –0.3V to VFB1 COMP2B VOUTS2 COMP2A V EXTV FB2 PGOOD2 CC V – E OUTS2 , VFB1 (Note 6).. –0.3V to (INTVCC+0.3V) MODE_ COMP1A, COMP2A (Note 6) ... –0.3V to 2.7V FREQ INTV CPWR TRACK/SS2 PLLIN CLKOUT CC COMP1B, COMP2B, V F FB2 .. –0.3V to 2.7V DRV COMP1B V COMP1A V CC Peak Output Current ...100mA OUTS1 FB1 PGOOD1 DRVCC G Internal Operating Temperature Range (Note 2) .. –40°C to 125°C PHASMD SGND TRACK/SS1 RUN1 H Storage Temperature Range .. –55°C to 125°C – SW1 V GND Peak Solder Reflow Package Body Temperature .. 245°C OUTS1 J VOUT1 TEMP1– K GND VIN1 TEMP1+ L BGA PACKAGE 88-LEAD (15mm × 11.25mm × 5.74mm) TJMAX = 125°C, θJA = 7°C/W, θJCbottom = 1.5°C/W, θJCtop = 3.7°C/W, θJB + θBA ≅ 7°C/W θ VALUES DEFINED PER JESD51-12 WEIGHT = 2.2g
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4662EY#PBF LTM4662Y SAC305 (RoHS) e1 LTM4662IY#PBF LTM4662Y BGA 3 –40°C to 125°C LTM4662IY SnPb (63/37) LTM4662Y e0 • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures container. Ball finish code is per IPC/JEDEC J-STD-609. • LGA and BGA Package and Tray Drawings Rev. A 2 For more information www.analog.com Document Outline Operation Applications Information Package Description Package Photo Related Parts Features Applications Typical Application Description Absolute Maximum Ratings Order Information Pin Configuration Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Package Description Revision History Package Photo Design Resources Related Parts
