Datasheet AD5235-EP (Analog Devices) - 7
| Manufacturer | Analog Devices |
| Description | Nonvolatile Memory, Dual 1024-Position Digital Potentiometer |
| Pages / Page | 14 / 7 — Enhanced Product. AD5235-EP. ABSOLUTE MAXIMUM RATINGS. Table 3. … |
| Revision | B |
| File Format / Size | PDF / 540 Kb |
| Document Language | English |
Enhanced Product. AD5235-EP. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter. Rating. ESD CAUTION
Model Line for this Datasheet
Text Version of Document
Enhanced Product AD5235-EP ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
Table 3.
stress rating only; functional operation of the product at these
Parameter Rating
or any other conditions above those indicated in the operational VDD to GND –0.3 V to +7 V section of this specification is not implied. Operation beyond VSS to GND +0.3 V to −7 V the maximum operating conditions for extended periods may VDD to VSS 7 V affect product reliability. VA, VB, VW to GND VSS − 0.3 V to VDD + 0.3 V IA, IB, IW Pulsed1 ±2.5 mA
ESD CAUTION
Continuous ±1.1 mA Digital Input and Output Voltage to GND −0.3 V to VDD + 0.3 V Operating Temperature Range2 −40°C to +125°C Maximum Junction Temperature (TJ max) 150°C Storage Temperature Range −65°C to +150°C Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C Thermal Resistance Junction-to-Ambient, θJA 150°C/W Junction-to-Case, θJC 28°C/W Package Power Dissipation (TJ max − TA)/θJA 1 Maximum terminal current is bounded by the maximum current handling of the switches, maximum power dissipation of the package and the maximum applied voltage across any two of the A, B, and W terminals at a given resistance. 2 Includes programming of nonvolatile memory. Rev. B | Page 7 of 14 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS INTERFACE TIMING AND EEMEM RELIABILITY CHARACTERISTICS Timing Diagrams ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
TA = 25°C, unless otherwise noted. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
Table 3.
stress rating only; functional operation of the product at these
Parameter Rating
or any other conditions above those indicated in the operational VDD to GND –0.3 V to +7 V section of this specification is not implied. Operation beyond VSS to GND +0.3 V to −7 V the maximum operating conditions for extended periods may VDD to VSS 7 V affect product reliability. VA, VB, VW to GND VSS − 0.3 V to VDD + 0.3 V IA, IB, IW Pulsed1 ±2.5 mA
ESD CAUTION
Continuous ±1.1 mA Digital Input and Output Voltage to GND −0.3 V to VDD + 0.3 V Operating Temperature Range2 −40°C to +125°C Maximum Junction Temperature (TJ max) 150°C Storage Temperature Range −65°C to +150°C Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C Thermal Resistance Junction-to-Ambient, θJA 150°C/W Junction-to-Case, θJC 28°C/W Package Power Dissipation (TJ max − TA)/θJA 1 Maximum terminal current is bounded by the maximum current handling of the switches, maximum power dissipation of the package and the maximum applied voltage across any two of the A, B, and W terminals at a given resistance. 2 Includes programming of nonvolatile memory. Rev. B | Page 7 of 14 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS INTERFACE TIMING AND EEMEM RELIABILITY CHARACTERISTICS Timing Diagrams ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
