Triaxis Position Processor (Melexis) - 8

MLX90374 - Triaxis® Position Processor
Datasheet
3. Pin Definitions and Descriptions
3.1. Pin Definition for SOIC-8 package
Pin # Name Description
1 VDD Supply 2 Input For test or Application 3 OUT2 Second Output 4 Test For test or application 5 OUT1 First Output 6 VSS Digital ground 7 VDEC Decoupling pin 8 VSS Analog ground Table 4 - SOIC-8 Pins definition and description Pins Input and Test are internally grounded in application. For optimal EMC behaviour always connect the unused pins to the electrical ground of the PCB. 3.2. Pin Definition for DMP DMP-4 package adds a dual output PCB-less solution to the Triaxis® product family.
Pin # Name Description
1 OUT1 First Output 2 VSS Ground 3 VDD Supply 4 OUT2 Second Output Table 5 - DMP-4 Pins definition and description REVISION 4 - 20 MAR 2019 Page 8 of 77 3901090374 Document Outline Features and Benefits Application Examples Description Ordering Information 1. Functional Diagram and Application Modes 2. Glossary of Terms 3. Pin Definitions and Descriptions 3.1. Pin Definition for SOIC-8 package 3.2. Pin Definition for DMP 4. Absolute Maximum Ratings 5. General Electrical Specifications 6. Timing Specification 6.1. General Timing Specifications 6.2. Timing Modes 6.2.1. Continuous Asynchronous Acquisition Mode 6.2.2. Continuous Synchronous Acquisition Mode 6.3. Timing Definitions 6.3.1. Startup Time 6.3.1.1. Normal Startup 6.3.1.2. Safe Startup 6.3.1.3. Startup phase in PWM mode 6.3.2. Latency (average) 6.3.3. Step Response (worst case) 6.4. PWM timing specifications 6.5. SENT timing specifications 7. Magnetic Field Specifications 7.1. Rotary Stray-field Immune Mode (-100 code) 7.2. Linear Stray-field Immune (-200 code) 7.3. Standard/Legacy Mode (-300 code) 8. Accuracy Specifications 8.1. Definition 8.1.1. Intrinsic Linearity Error 8.1.2. Total Angle Drift 8.2. Rotary Stray-field Immune (-100 code) 8.2.1. Nominal Performance 8.2.2. Limited Performances 8.3. Linear Stray-field Immune Mode (-200 code) 8.3.1. Nominal Performances 8.3.2. Limited Performances 8.4. Standard/Legacy Mode (-300 code) 8.4.1. Nominal Performances 8.4.2. Limited Performances 9. Memory Specifications 10. Digital output protocol 10.1. PWM (pulse width modulation) 10.1.1. Definition 10.1.2. PWM performances 10.2. Single Edge Nibble Transmission (SENT) SAE J2716 10.2.1. Sensor message definition 10.2.2. Sensor message frame contents 10.2.3. Single secure sensor A.3 10.2.4. Dual Throttle position sensor A.1 10.2.5. Start-up behaviour 10.2.6. SENT Output Timing configuration 10.2.7. Serial message channel (slow channel) 10.2.8. Serial Message Error Code 10.2.9. SENT configuration shorthand definition 11. End-User Programmable Items 11.1. End User Identification Items 12. Description of End-User Programmable Items 12.1. Sensor Front-End 12.1.1. SENSING MODE 12.1.2. GAINMIN and GAINMAX Parameters 12.2. Sensor DSP Configuration 12.2.1. Discontinuity Point (or Zero Degree Point) 12.2.2. CW (Clockwise) Parameter 12.2.3. Filter 12.2.3.1. FIR Filter 12.2.3.2. Exponential Moving Average (IIR) Filter 12.2.4. WORKING_RANGE Parameter for Angle Range Selection 12.2.5. WORK_RANGE_GAIN Parameter for Angle Range Selection 12.2.6. Piecewise Linear Transform 12.2.6.1. 4-Pts LNR Parameters 12.2.6.2. 8-Pts LNR Parameters 12.2.6.3. 17-Pts LNR Parameters 12.2.6.4. 32-Pts LNR parameters 12.2.7. Scaling Parameter 12.2.8. Thermal offset correction - OUTSLOPE 12.2.9. Second Output Gain and Offset Parameters 12.2.10. CLAMPING Parameters 12.3. Selection of Output modes 12.3.1. Digital Output Protocol (PROTOCOL) 12.3.2. PWM Output Polarity and Frequency 12.3.3. PWM Redundant Output 12.3.4. Dual PWM fault Reporting Mode 12.3.5. OUT mode (ABE_OUT_MODE) 12.3.6. SENT Serial Channel Configuration - Status and Communication Nibble 12.3.7. Switch Function (Kickdown) 12.4. Programmable Diagnostics Settings 12.4.1. Diagnostics Global Enable 12.4.2. Diagnostic Debouncer 12.4.3. Over/Under Temperature Diagnostic 12.4.4. PWM Diagnostic 13. Functional Safety 13.1. Safety Manual 13.2. Safety Mechanisms 14. Recommended Application Diagrams 14.1. Wiring with the MLX90374 in SOIC-8 Package 14.2. Wiring with the MLX90374 in DMP-4 Package (built-in capacitors) 15. Standard information regarding manufacturability of Melexis products with different soldering processes 16. ESD Precautions 17. Package Information 17.1. SOIC-8 - Package Dimensions 17.2. SOIC-8 - Pinout and Marking 17.3. SOIC-8 - Sensitive spot positioning 17.3.1. Rotary Stray-field Immune and Standard Mode Applications 17.3.2. Linear Stray-field Immune Applications 17.4. SOIC-8 - Angle detection 17.5. DMP-4 - Package Outline Dimensions (POD) STD1 1.27 17.6. DMP-4 - Package Outline Dimensions (POD) STD3 2.00 17.7. DMP-4 - Marking 17.8. DMP-4 - Sensitive Spot Positioning 17.8.1. Rotary Stray-field Immune or Standard Mode Applications 17.8.2. Linear Stray-field Immune Applications 17.9. DMP-4 - Angle detection 17.10. Packages Thermal Performances 18. Contact 19. Disclaimer 20. Revision History Table