Datasheet BC847, BC547 (NXP) - 5
| Manufacturer | NXP |
| Description | 45 V, 100 mA NPN general-purpose transistors |
| Pages / Page | 15 / 5 — NXP Semiconductors. BC847/BC547 series. 45 V, 100 mA NPN general-purpose … |
| File Format / Size | PDF / 100 Kb |
| Document Language | English |
NXP Semiconductors. BC847/BC547 series. 45 V, 100 mA NPN general-purpose transistors. Limiting values. Table 6. Symbol. Parameter
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NXP Semiconductors BC847/BC547 series 45 V, 100 mA NPN general-purpose transistors 5. Limiting values Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 50 V VCEO collector-emitter voltage open base - 45 V VEBO emitter-base voltage open collector - 6 V IC collector current - 100 mA ICM peak collector current single pulse; - 200 mA t ≤ p 1 ms IBM peak base current single pulse; - 100 mA t ≤ p 1 ms P ≤ tot total power dissipation Tamb 25 °C SOT23 [1] - 250 mW SOT323 [1] - 200 mW SOT416 [1] - 150 mW SOT883 [2][3] - 250 mW SOT54 [1] - 500 mW Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.
6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from in free air junction to ambient SOT23 [1] - - 500 K/W SOT323 [1] - - 625 K/W SOT416 [1] - - 833 K/W SOT883 [2][3] - - 500 K/W SOT54 [1] - - 250 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint. BC847_BC547_SER_7 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 07 — 10 December 2008 5 of 15
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Package outline 9. Packing information 10. Revision history 11. Legal information 11.1 Data sheet status 11.2 Definitions 11.3 Disclaimers 11.4 Trademarks 12. Contact information 13. Contents
NXP Semiconductors BC847/BC547 series 45 V, 100 mA NPN general-purpose transistors 5. Limiting values Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 50 V VCEO collector-emitter voltage open base - 45 V VEBO emitter-base voltage open collector - 6 V IC collector current - 100 mA ICM peak collector current single pulse; - 200 mA t ≤ p 1 ms IBM peak base current single pulse; - 100 mA t ≤ p 1 ms P ≤ tot total power dissipation Tamb 25 °C SOT23 [1] - 250 mW SOT323 [1] - 200 mW SOT416 [1] - 150 mW SOT883 [2][3] - 250 mW SOT54 [1] - 500 mW Tj junction temperature - 150 °C Tamb ambient temperature −65 +150 °C Tstg storage temperature −65 +150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.
6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from in free air junction to ambient SOT23 [1] - - 500 K/W SOT323 [1] - - 625 K/W SOT416 [1] - - 833 K/W SOT883 [2][3] - - 500 K/W SOT54 [1] - - 250 K/W [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint. BC847_BC547_SER_7 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 07 — 10 December 2008 5 of 15
Document Outline 1. Product profile 1.1 General description 1.2 Features 1.3 Applications 1.4 Quick reference data 2. Pinning information 3. Ordering information 4. Marking 5. Limiting values 6. Thermal characteristics 7. Characteristics 8. Package outline 9. Packing information 10. Revision history 11. Legal information 11.1 Data sheet status 11.2 Definitions 11.3 Disclaimers 11.4 Trademarks 12. Contact information 13. Contents
