Datasheet HMC788A-EP (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | 0.01 GHz to 10 GHz, MMIC, GaAs, pHEMT RF Gain Block |
| Pages / Page | 8 / 4 — HMC788A-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS. THERMAL … |
| Revision | A |
| File Format / Size | PDF / 169 Kb |
| Document Language | English |
HMC788A-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 2. Parameter. Rating. Table 3. Thermal Resistance
Text Version of Document
link to page 4 link to page 4
HMC788A-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
Thermal performance is directly linked to printed circuit board V (PCB) design and operating environment. Careful attention to CC 7 V RF PCB thermal design is required. IN (VCC = 5 V) 20 dBm Continuous Power Dissipation, P 1 DISS θJC is the junction to case thermal resistance. TCASE = 85°C 0.76 W T
Table 3. Thermal Resistance
CASE = 105°C 0.59 W Junction (T
Package Type θJC Unit
J) Temperature 175°C Operating (T CP-6-101 118.0 °C/W OPR) Temperature Range −55°C to +105°C Storage Temperature Range −65°C to +150°C 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board with nine thermal vias. See JEDEC JESD51. Electrostatic Discharge (ESD) Sensitivity, Class 1A Human Body Model (HBM)
POWER DERATING CURVES
1 For maximum power dissipation vs. case temperature, see Figure 2. Figure 2 shows the maximum power dissipation vs. case Stresses at or above those listed under Absolute Maximum temperature. Ratings may cause permanent damage to the product. This is a
1.000
stress rating only; functional operation of the product at these
0.875
or any other conditions above those indicated in the operational
W) (
section of this specification is not implied. Operation beyond
0.750 TION
the maximum operating conditions for extended periods may
PA 0.625
affect product reliability.
ISSI D 0.500 ER W 0.375 M PO MU 0.250 XI MA 0.125 0
020
–60 –40 –20 0 20 40 60 80 100 120 CASE TEMPERATURE (°C)
16213- Figure 2. Maximum Power Dissipation vs. Case Temperature
ESD CAUTION
Rev. A | Page 4 of 8 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance Power Derating Curves ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Outline Dimensions Ordering Guide
HMC788A-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 2. Parameter Rating
Thermal performance is directly linked to printed circuit board V (PCB) design and operating environment. Careful attention to CC 7 V RF PCB thermal design is required. IN (VCC = 5 V) 20 dBm Continuous Power Dissipation, P 1 DISS θJC is the junction to case thermal resistance. TCASE = 85°C 0.76 W T
Table 3. Thermal Resistance
CASE = 105°C 0.59 W Junction (T
Package Type θJC Unit
J) Temperature 175°C Operating (T CP-6-101 118.0 °C/W OPR) Temperature Range −55°C to +105°C Storage Temperature Range −65°C to +150°C 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board with nine thermal vias. See JEDEC JESD51. Electrostatic Discharge (ESD) Sensitivity, Class 1A Human Body Model (HBM)
POWER DERATING CURVES
1 For maximum power dissipation vs. case temperature, see Figure 2. Figure 2 shows the maximum power dissipation vs. case Stresses at or above those listed under Absolute Maximum temperature. Ratings may cause permanent damage to the product. This is a
1.000
stress rating only; functional operation of the product at these
0.875
or any other conditions above those indicated in the operational
W) (
section of this specification is not implied. Operation beyond
0.750 TION
the maximum operating conditions for extended periods may
PA 0.625
affect product reliability.
ISSI D 0.500 ER W 0.375 M PO MU 0.250 XI MA 0.125 0
020
–60 –40 –20 0 20 40 60 80 100 120 CASE TEMPERATURE (°C)
16213- Figure 2. Maximum Power Dissipation vs. Case Temperature
ESD CAUTION
Rev. A | Page 4 of 8 Document Outline Features Enhanced Product Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance Power Derating Curves ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Outline Dimensions Ordering Guide
