Datasheet BL-HBGR32L-3-TRB-8 (American Bright) - 10
| Manufacturer | American Bright |
| Description | RGB LED device with built-in IC |
| Pages / Page | 10 / 10 — BRIGHT LED ELECTRONICS CORP. Package and Label of Products:. BRIGHT LED … |
| File Format / Size | PDF / 828 Kb |
| Document Language | English |
BRIGHT LED ELECTRONICS CORP. Package and Label of Products:. BRIGHT LED LOGO. Part No. Quantity. BIN. Sealing Date. X X X X X
Model Line for this Datasheet
Text Version of Document
BRIGHT LED ELECTRONICS CORP.
BL-HBGR32L-3-TRB-8 ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs within the rated figures. Also, caution should be taken not to overload LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪ Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 20% RH. (3) Devices require baking before mounting, if: 2a or 2b is not met. (4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±5℃. ●
Package and Label of Products:
(1) Package: Products are packed in one bag of 1000 pcs (one taping reel) and a label is attached to each bag. (2) Label:
BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date X X X X X x xx xx xx Year Month Day Manufactur e Location
Ver1.0 Page: 10 of 10
BL-HBGR32L-3-TRB-8 ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs within the rated figures. Also, caution should be taken not to overload LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪ Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 20% RH. (3) Devices require baking before mounting, if: 2a or 2b is not met. (4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±5℃. ●
Package and Label of Products:
(1) Package: Products are packed in one bag of 1000 pcs (one taping reel) and a label is attached to each bag. (2) Label:
BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date X X X X X x xx xx xx Year Month Day Manufactur e Location
Ver1.0 Page: 10 of 10
