Datasheet DPS368 (Infineon) - 7
| Manufacturer | Infineon |
| Description | XENSIV™ DPS368 - ultra small waterproof pressure sensor, environmentally protected against water (IPx8), dust & humidity |
| Pages / Page | 44 / 7 — DPS368. Specifications. 2.2. Block Diagram. Figure 2. 3.1. Operating … |
| Revision | 01_00 |
| File Format / Size | PDF / 3.0 Mb |
| Document Language | English |
DPS368. Specifications. 2.2. Block Diagram. Figure 2. 3.1. Operating Range. Table 3. Parameter. Symbol. Values. Unit. Note / Test Condition. Min
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DPS368 Specifications 2.2 Block Diagram Figure 2 3 Specifications 3.1 Operating Range
The following operating conditions must not be exceeded in order to ensure correct operation of the device. All parameters specified in the following sections refer to these operating conditions, unless noted otherwise.
Table 3 Operating Range Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max.
Pressure Pa 300 1200 hPa Temperature Ta -40 85 °C Supply voltage VDD 1.7 3.6 V Supply voltage IO VDDIO 1.2 3.6 V Supply voltage ramp-up time tvddup 0.001 5 ms Time for supply voltage to reach 90% of final value. Solder drift
1)
0.8 hPa Minimum solder height 50um. Long term stability ±1 hPa Depending on environmental conditions. 1 Effects of solder drift can be eliminated by one point calibration. See AN487. Preliminary datasheet 7 v1.0 2019-03-14 Document Outline Product Description Features Typical applications Product Validation Table of contents 1 Definitions, acronyms and abbreviations 1.1 Definitions 2 Pin Configuration and Block Diagram 2.1 Pin Configuration and Description 2.2 Block Diagram 3 Specifications 3.1 Operating Range 3.2 Absolute Maximum Ratings 3.3 Current Consumption 3.4 Temperature Transfer Function 3.5 Pressure Transfer Function 3.6 Timing Characteristics 4 Functional Description 4.1 Operating Modes 4.2 Mode transition diagram 4.3 Start-up sequence 4.4 Measurement Precision and Rate 4.5 Sensor Interface 4.6 Interrupt 4.7 Result Register Operation 4.8 FIFO Operation 4.9 Calibration and Measurement Compensation 4.9.1 How to Calculate Compensated Pressure Values 4.9.2 How to Calculate Compensated Temperature Values 4.9.3 Compensation Scale Factors 4.9.4 Pressure and Temperature calculation flow 5 Applications 5.1 Measurement Settings and Use Case Examples 5.2 Application Circuit Example 5.3 IIR filtering 6 Digital interfaces 6.1 I2C Interface 6.2 SPI Interface 6.3 Interface parameters specification 6.3.1 General interface parameters 6.3.1.1 I2C timings 6.3.1.2 SPI timings 7 Register Map 8 Register description 8.1 Pressure Data (PRS_Bn) 8.1.1 PRS_B2 8.1.2 PRS_B1 8.1.3 PRS_B0 8.2 Temperature Data (TMP_Tn) 8.2.1 TMP_B2 8.2.2 TMP_B1 8.2.3 TMP_B0 8.3 Pressure Configuration (PRS_CFG) 8.4 Temperature Configuration(TMP_CFG) 8.5 Sensor Operating Mode and Status (MEAS_CFG) 8.6 Interrupt and FIFO configuration (CFG_REG) 8.7 Interrupt Status (INT_STS) 8.8 FIFO Status (FIFO_STS) 8.9 Soft Reset and FIFO flush (RESET) 8.10 Product and Revision ID (ID) 8.11 Calibration Coefficients (COEF) 8.12 Coefficient Source 9 Package Dimensions 9.1 Package drawing 10 Footprint and stencil recommendation 11 Reflow soldering and board assembly 12 Package Handling Revision history Disclaimer
DPS368 Specifications 2.2 Block Diagram Figure 2 3 Specifications 3.1 Operating Range
The following operating conditions must not be exceeded in order to ensure correct operation of the device. All parameters specified in the following sections refer to these operating conditions, unless noted otherwise.
Table 3 Operating Range Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max.
Pressure Pa 300 1200 hPa Temperature Ta -40 85 °C Supply voltage VDD 1.7 3.6 V Supply voltage IO VDDIO 1.2 3.6 V Supply voltage ramp-up time tvddup 0.001 5 ms Time for supply voltage to reach 90% of final value. Solder drift
1)
0.8 hPa Minimum solder height 50um. Long term stability ±1 hPa Depending on environmental conditions. 1 Effects of solder drift can be eliminated by one point calibration. See AN487. Preliminary datasheet 7 v1.0 2019-03-14 Document Outline Product Description Features Typical applications Product Validation Table of contents 1 Definitions, acronyms and abbreviations 1.1 Definitions 2 Pin Configuration and Block Diagram 2.1 Pin Configuration and Description 2.2 Block Diagram 3 Specifications 3.1 Operating Range 3.2 Absolute Maximum Ratings 3.3 Current Consumption 3.4 Temperature Transfer Function 3.5 Pressure Transfer Function 3.6 Timing Characteristics 4 Functional Description 4.1 Operating Modes 4.2 Mode transition diagram 4.3 Start-up sequence 4.4 Measurement Precision and Rate 4.5 Sensor Interface 4.6 Interrupt 4.7 Result Register Operation 4.8 FIFO Operation 4.9 Calibration and Measurement Compensation 4.9.1 How to Calculate Compensated Pressure Values 4.9.2 How to Calculate Compensated Temperature Values 4.9.3 Compensation Scale Factors 4.9.4 Pressure and Temperature calculation flow 5 Applications 5.1 Measurement Settings and Use Case Examples 5.2 Application Circuit Example 5.3 IIR filtering 6 Digital interfaces 6.1 I2C Interface 6.2 SPI Interface 6.3 Interface parameters specification 6.3.1 General interface parameters 6.3.1.1 I2C timings 6.3.1.2 SPI timings 7 Register Map 8 Register description 8.1 Pressure Data (PRS_Bn) 8.1.1 PRS_B2 8.1.2 PRS_B1 8.1.3 PRS_B0 8.2 Temperature Data (TMP_Tn) 8.2.1 TMP_B2 8.2.2 TMP_B1 8.2.3 TMP_B0 8.3 Pressure Configuration (PRS_CFG) 8.4 Temperature Configuration(TMP_CFG) 8.5 Sensor Operating Mode and Status (MEAS_CFG) 8.6 Interrupt and FIFO configuration (CFG_REG) 8.7 Interrupt Status (INT_STS) 8.8 FIFO Status (FIFO_STS) 8.9 Soft Reset and FIFO flush (RESET) 8.10 Product and Revision ID (ID) 8.11 Calibration Coefficients (COEF) 8.12 Coefficient Source 9 Package Dimensions 9.1 Package drawing 10 Footprint and stencil recommendation 11 Reflow soldering and board assembly 12 Package Handling Revision history Disclaimer
