Datasheet STSPIN32F0B (STMicroelectronics) - 6
| Manufacturer | STMicroelectronics |
| Description | Advanced single shunt BLDC controller with embedded STM32 MCU |
| Pages / Page | 36 / 6 — STSPIN32F0B. ESD protections. 3.2. Table 2. ESD protection ratings. … |
| File Format / Size | PDF / 6.5 Mb |
| Document Language | English |
STSPIN32F0B. ESD protections. 3.2. Table 2. ESD protection ratings. Symbol. Parameter. Test condition. Class. Value. Unit. 3.3
Model Line for this Datasheet
Text Version of Document
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STSPIN32F0B ESD protections 3.2 ESD protections Table 2. ESD protection ratings Symbol Parameter Test condition Class Value Unit
Conforming to ANSI/ESDA/JEDEC HBM Human body model H2 2 kV JS-001-2014 Conforming to ANSI/ESDA/JEDEC CDM Charge device model C2 750 V JS-002-2014
3.3 Recommended operating conditions Table 3. Recommended operating conditions Symbol Parameter Test condition Min. Typ. Max. Unit
VM Power supply voltage - 6.7 (1) - 45 V dVM/dt Power supply voltage slope VM = 45 V - - 0.75 V/µs VDDA DC/DC regulator output voltage - - 3.3 - V LSW Output inductance - - 22 - µH CDDA Output capacitance - 47 - - µF ESRDDA Output capacitor ESR - - - 200 mΩ 13 < VM < 45 V - 12 - VREG12 Linear regulator output and gate driver supply voltage V Shorted to VM 6.7(1) - 15 CREG Load capacitance - 1 10 - µF ESRREG ESR load capacitance - - - 1.2 Ω VBO Floating supply voltage (2) - - VREG12 - 1 15 V VCP Comparator input voltage - 0 - 1 V Analog IC -40 - 125 °C Tj Operating junction temperature MCU (3) -40 - 125 °C 1. UVLO threshold VMOn_max. 2. VBO = VBOOT - VOUT. 3. See the STM32F031C6 datasheet (suffix 7 version).
3.4 Thermal data
Thermal values are calculated by simulation with the following boundary conditions: 2s2p board as per the std. JEDEC (JESD51-7) in natural convection, board dimensions: 114.3 x 76.2 x 1.6 mm, ambient temperature: 25 °C.
Table 4. Thermal data Symbol Parameter Value Unit
Rth (JA) Thermal resistance junction to ambient 45.6 °C/W
DS12907
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Rev 1 page 6/36
Document Outline 1 Description 2 Block diagrams 3 Electrical data 3.1 Absolute maximum ratings 3.2 ESD protections 3.3 Recommended operating conditions 3.4 Thermal data 4 Electrical characteristics 5 Pin description 6 Device description 6.1 UVLO and thermal protections 6.1.1 UVLO on supply voltages 6.1.2 Thermal protection 6.2 DC/DC buck regulator 6.2.1 External optional 3.3 V supply voltage 6.3 Linear regulator 6.4 Standby mode 6.5 Gate drivers 6.6 Microcontroller unit 6.6.1 Memories and boot mode 6.6.2 Power management 6.6.3 High-speed external clock source 6.6.4 Advanced-control timer (TIM1) 6.7 Test mode 6.8 Operational amplifier 6.9 Comparator 6.10 ESD protection strategy 7 Application example 8 Package information 8.1 VFQFPN48 7 x 7 package information Revision history Contents List of tables List of figures
STSPIN32F0B ESD protections 3.2 ESD protections Table 2. ESD protection ratings Symbol Parameter Test condition Class Value Unit
Conforming to ANSI/ESDA/JEDEC HBM Human body model H2 2 kV JS-001-2014 Conforming to ANSI/ESDA/JEDEC CDM Charge device model C2 750 V JS-002-2014
3.3 Recommended operating conditions Table 3. Recommended operating conditions Symbol Parameter Test condition Min. Typ. Max. Unit
VM Power supply voltage - 6.7 (1) - 45 V dVM/dt Power supply voltage slope VM = 45 V - - 0.75 V/µs VDDA DC/DC regulator output voltage - - 3.3 - V LSW Output inductance - - 22 - µH CDDA Output capacitance - 47 - - µF ESRDDA Output capacitor ESR - - - 200 mΩ 13 < VM < 45 V - 12 - VREG12 Linear regulator output and gate driver supply voltage V Shorted to VM 6.7(1) - 15 CREG Load capacitance - 1 10 - µF ESRREG ESR load capacitance - - - 1.2 Ω VBO Floating supply voltage (2) - - VREG12 - 1 15 V VCP Comparator input voltage - 0 - 1 V Analog IC -40 - 125 °C Tj Operating junction temperature MCU (3) -40 - 125 °C 1. UVLO threshold VMOn_max. 2. VBO = VBOOT - VOUT. 3. See the STM32F031C6 datasheet (suffix 7 version).
3.4 Thermal data
Thermal values are calculated by simulation with the following boundary conditions: 2s2p board as per the std. JEDEC (JESD51-7) in natural convection, board dimensions: 114.3 x 76.2 x 1.6 mm, ambient temperature: 25 °C.
Table 4. Thermal data Symbol Parameter Value Unit
Rth (JA) Thermal resistance junction to ambient 45.6 °C/W
DS12907
-
Rev 1 page 6/36
Document Outline 1 Description 2 Block diagrams 3 Electrical data 3.1 Absolute maximum ratings 3.2 ESD protections 3.3 Recommended operating conditions 3.4 Thermal data 4 Electrical characteristics 5 Pin description 6 Device description 6.1 UVLO and thermal protections 6.1.1 UVLO on supply voltages 6.1.2 Thermal protection 6.2 DC/DC buck regulator 6.2.1 External optional 3.3 V supply voltage 6.3 Linear regulator 6.4 Standby mode 6.5 Gate drivers 6.6 Microcontroller unit 6.6.1 Memories and boot mode 6.6.2 Power management 6.6.3 High-speed external clock source 6.6.4 Advanced-control timer (TIM1) 6.7 Test mode 6.8 Operational amplifier 6.9 Comparator 6.10 ESD protection strategy 7 Application example 8 Package information 8.1 VFQFPN48 7 x 7 package information Revision history Contents List of tables List of figures
