Datasheet AD7490-EP (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | 16-Channel, 1MSPS, 12-Bit ADC with Sequencer in 28-Lead TSSOP |
| Pages / Page | 12 / 6 — AD7490-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS. Table 3. … |
| Revision | B |
| File Format / Size | PDF / 406 Kb |
| Document Language | English |
AD7490-EP. Enhanced Product. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter. Rating. ESD CAUTION
Model Line for this Datasheet
Text Version of Document
AD7490-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
Table 3.
stress rating only; functional operation of the product at these
Parameter Rating
or any other conditions above those indicated in the operational VDD to GND −0.3 V to +7 V section of this specification is not implied. Operation beyond VDRIVE to GND −0.3 V to VDD + 0.3 V the maximum operating conditions for extended periods may Analog Input Voltage to GND −0.3 V to VDD + 0.3 V affect product reliability. Digital Input Voltage to GND −0.3 V to +7 V Digital Output Voltage to GND −0.3 V to VDD + 0.3 V REFIN to GND −0.3 V to VDD + 0.3 V
ESD CAUTION
Input Current to Any Pin Except Supplies1 ±10 mA Operating Temperature Ranges Enhanced Plastic (EP Version) −55°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C TSSOP Package, Power Dissipation 450 mW θJA Thermal Impedance 97.9°C/W (TSSOP) θJC Thermal Impedance 14°C/W (TSSOP) Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C Pb-Free Temperature, Soldering Reflow 260 (+0)°C ESD 250 V 1 Transient currents of up to 100 mA do not cause SCR latch-up. Rev. B | Page 6 of 12 Document Outline Features Enhanced Product Features Functional Block Diagram General Description Product Highlights Revision History Specifications Timing Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Outline Dimensions Ordering Guide
TA = 25°C, unless otherwise noted. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
Table 3.
stress rating only; functional operation of the product at these
Parameter Rating
or any other conditions above those indicated in the operational VDD to GND −0.3 V to +7 V section of this specification is not implied. Operation beyond VDRIVE to GND −0.3 V to VDD + 0.3 V the maximum operating conditions for extended periods may Analog Input Voltage to GND −0.3 V to VDD + 0.3 V affect product reliability. Digital Input Voltage to GND −0.3 V to +7 V Digital Output Voltage to GND −0.3 V to VDD + 0.3 V REFIN to GND −0.3 V to VDD + 0.3 V
ESD CAUTION
Input Current to Any Pin Except Supplies1 ±10 mA Operating Temperature Ranges Enhanced Plastic (EP Version) −55°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C TSSOP Package, Power Dissipation 450 mW θJA Thermal Impedance 97.9°C/W (TSSOP) θJC Thermal Impedance 14°C/W (TSSOP) Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C Pb-Free Temperature, Soldering Reflow 260 (+0)°C ESD 250 V 1 Transient currents of up to 100 mA do not cause SCR latch-up. Rev. B | Page 6 of 12 Document Outline Features Enhanced Product Features Functional Block Diagram General Description Product Highlights Revision History Specifications Timing Specifications Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Outline Dimensions Ordering Guide
